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200 00$aEMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan : [proceedings
210 31$a[Place of publication not identified]$cIEEE$d2005
215   $a1 online resource (vi, 301 pages)
300   $aBibliographic Level Mode of Issuance: Monograph
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606   $aElectronic packaging$vCongresses
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