LEADER 01362oam  2200445zu 450 
001 9910145413903321
005 20241212215621.0
010   $a9781424438167
010   $a1424438160
010   $a9781424438150
010   $a1424438152
035   $a(CKB)1000000000709916
035   $a(SSID)ssj0000453007
035   $a(PQKBManifestationID)12171159
035   $a(PQKBTitleCode)TC0000453007
035   $a(PQKBWorkID)10473233
035   $a(PQKB)11729119
035   $a(NjHacI)991000000000709916
035   $a(EXLCZ)991000000000709916
100   $a20160829d2009      uy 
101 0 $aeng
135   $aur|||||||||||
181   $ctxt
182   $cc
183   $acr
200 10$a2009 17th International Conference on Advanced Thermal Processing of Semiconductors
210 31$a[Place of publication not identified]$cI E E E$d2009
215   $a1 online resource (216 pages) $cillustrations
300   $aBibliographic Level Mode of Issuance: Monograph
311 08$a9781424438143 
311 08$a1424438144 
606   $aSemiconductor doping$vCongresses
615  0$aSemiconductor doping
676   $a004.6
702   $aIEEE Staff
801  0$bPQKB
906   $aPROCEEDING
912   $a9910145413903321
996   $a2009 17th International Conference on Advanced Thermal Processing of Semiconductors$92501864
997   $aUNINA