LEADER 05734nam 2200757Ia 450 001 9910144378903321 005 20200520144314.0 010 $a1-282-01071-9 010 $a9786612010712 010 $a0-470-77287-5 010 $a0-470-77288-3 035 $a(CKB)1000000000579295 035 $a(EBL)406516 035 $a(SSID)ssj0000245813 035 $a(PQKBManifestationID)11221295 035 $a(PQKBTitleCode)TC0000245813 035 $a(PQKBWorkID)10177115 035 $a(PQKB)11601322 035 $a(Au-PeEL)EBL406516 035 $a(CaPaEBR)ebr10270687 035 $a(CaONFJC)MIL201071 035 $a(OCoLC)264714645 035 $a(CaSebORM)9780470511664 035 $a(MiAaPQ)EBC406516 035 $a(EXLCZ)991000000000579295 100 $a20080320d2008 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aSignal integrity and radiated emission of high-speed digital systems$b[electronic resource] /$fSpartaco Caniggia, Francescaromana Maradei 205 $a1st edition 210 $aChichester, U.K. $cWiley$d2008 215 $a1 online resource (554 p.) 300 $aDescription based upon print version of record. 311 $a0-470-51166-4 320 $aIncludes bibliographical references and index. 327 $aSIGNAL INTEGRITY ANDRADIATED EMISSIONOF HIGH-SPEED DIGITAL SYSTEMS; Contents; List of Examples; Foreword; Preface; 1 Introduction to Signal Integrity and Radiated Emission in a Digital System; 1.1 Power and Signal Integrity; 1.1.1 Power Distribution Network; 1.1.2 Signal Distribution Network; 1.1.3 Noise Limitations and Design for Characteristic Impedance; 1.2 Radiated Emission; 1.2.1 Definition of Radiated Emission Sources; 1.2.2 Radiated Emission Standards; 1.2.3 Radiated Emission from a Real System; 1.3 Signaling and Logic Devices; 1.3.1 Overshoot, Undershoot and Plateau 327 $a1.3.2 Noise Immunity1.3.3 Timing Parameters; 1.3.4 Eye Diagram; 1.4 Modeling Digital Systems; 1.4.1 Mathematical Tools; 1.4.2 Spice-Like Circuit Simulators; 1.4.3 Full-Wave Numerical Tools; 1.4.4 Professional Simulators; References; 2 High-Speed Digital Devices; 2.1 Input/Output Static Characteristic; 2.1.1 Current and Voltage Specifications; 2.1.2 Transistor-Transistor Logic (TTL) Devices; 2.1.3 Complementary Metal Oxide Semiconductor (CMOS) Devices; 2.1.4 Emitter-Coupled Logic (ECL) Devices; 2.1.5 Low-Voltage Differential Signal (LVDS) Devices 327 $a2.1.6 Logic Devices Powered and the Logic Level2.2 Dynamic Characteristics: Gate Delay and Rise and Fall Times; 2.3 Driver and Receiver Modeling; 2.3.1 Types of Driver Model; 2.3.2 Driver Switching Currents Path; 2.3.3 Driver Non-Linear Behavioral Model; 2.3.4 Receiver Non-Linear Behavioral Modeling; 2.4 I/O Buffer Information Specification (IBIS) Models; 2.4.1 Structure of an IBIS Model; 2.4.2 IBIS Models and Spice; References; 3 Inductance; 3.1 Loop Inductance; 3.1.1 Inductances of Coupled Loops; 3.1.2 Inductances of Thin Filamentary Circuits; 3.1.3 Equivalent Circuit of Two Coupled Loops 327 $a3.1.4 L Matrix of Two Coupled Conductors Having a Reference Return Conductor3.1.5 L Calculation of a Three-Conductor Wire-Type Line; 3.1.6 Frequency-Dependent Internal Inductance; 3.2 Partial Inductance; 3.2.1 Partial Inductances of Coupled Loops; 3.2.2 Flux Area of Partial Inductance of Thin Filamentary Segments; 3.2.3 Loop Inductance Decomposed into Partial Inductances; 3.2.4 Self and Mutual Partial Inductance; 3.2.5 Inductance Between Two Parallel Conductors; 3.2.6 Loop Inductance Matrix Calculation by Partial Inductances; 3.2.7 Partial Inductance Associated with a Finite Ground Plane 327 $a3.2.8 Solving Inductance Problems in PCBs3.3 Differential Mode and Common Mode Inductance; 3.3.1 Differential Mode Inductance; 3.3.2 Common Mode Inductance; References; 4 Capacitance; 4.1 Capacitance Between Conductors; 4.1.1 Definition of Capacitance; 4.1.2 Partial Capacitance and Capacitance Matrix of Two Coupled Conductors Having a Reference Return Conductor; 4.1.3 Capacitance Matrix of n Coupled Conductors Having a Reference Return Conductor; 4.2 Differential Mode and Common Mode Capacitance; 4.2.1 Differential Mode Capacitance; 4.2.2 Common Mode Capacitance; References 327 $a5 Reflection on Signal Lines 330 $aBefore putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order to comply with the limits of radiated emission imposed by the standards. This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such as reflections, crosstalk, switching noise and radiated emission (RE) in high-speed digital systems are covered, which are essential for IT and telecoms applications. The highly important topic of modelling is covered which can reduce costs 606 $aElectromagnetic interference 606 $aDigital electronics 606 $aVery high speed integrated circuits 606 $aCrosstalk 606 $aSignal processing 615 0$aElectromagnetic interference. 615 0$aDigital electronics. 615 0$aVery high speed integrated circuits. 615 0$aCrosstalk. 615 0$aSignal processing. 676 $a621.382/24 686 $a05.42$2bcl 700 $aCaniggia$b Spartaco$0926614 701 $aMaradei$b Francescaromana$0926615 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910144378903321 996 $aSignal integrity and radiated emission of high-speed digital systems$92080770 997 $aUNINA