LEADER 03769nam 2200661 a 450 001 9910143641103321 005 20170828133108.0 010 $a1-280-67399-0 010 $a9786613650924 010 $a1-118-40580-3 010 $a1-118-40590-0 010 $a0-585-49974-8 035 $a(CKB)111090529248488 035 $a(EBL)892315 035 $a(OCoLC)787843291 035 $a(SSID)ssj0000098861 035 $a(PQKBManifestationID)11140492 035 $a(PQKBTitleCode)TC0000098861 035 $a(PQKBWorkID)10134373 035 $a(PQKB)10633877 035 $a(MiAaPQ)EBC892315 035 $a(EXLCZ)99111090529248488 100 $a20030715d2003 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aAdvances in joining of ceramics$b[electronic resource] $eproceedings of the Joining of Ceramics Symposium : held at the 104th Annual Meeting of the American Ceramic Society, April 28-May 1, 2002 in St. Louis, Missouri /$fedited by, Charles A. Lewinsohn, Mrityunjay Singh, Ronald Loehman 210 $aWesterville, Ohio $cAmerican Ceramic Society$dc2003 215 $a1 online resource (234 p.) 225 1 $aCeramic transactions,$x1042-1122 ;$vv. 138 300 $aDescription based upon print version of record. 311 $a1-57498-153-6 320 $aIncludes bibliographical references and index. 327 $aAdvances in Joining of Ceramics; Contents; Preface; Designing Joints in Ceramics; Selection and Function of Interlayer Materials in Ceramic/Ceramic Joining; Numerical Modeling of Solid State Bonding Based on Fundamental Bonding Mechanisms: For Bonding between Dissimilar Materials; Designing Joints with Graded Layers; Engineering High-Quality Ceramic-Metal Bonds; Brazing; Particulate Loading of High Temperature Brazes for Joining Engineering Ceramics; Development of a Copper Oxide-Silver Braze for Ceramic Joining; Biomedical Applications 327 $aA Review of Recent Investigations on Zirconia Joining for Biomedical ApplicationsJoining Zirconia and Alumina Bioceramics; Graded Coatings for Metallic Implant Alloys; High Temperature Applications; Thermal Cycling of Advanced Compressive Seal for Solid Oxide Fuel Cells; Brazing a Mixed Ionic/Electronic Conductor to an Oxidation Resistant Metal; Brazeless Approaches to Joining Silicon Carbide-Based Ceramics for High Temperature Applications; Processing Issues in Fabricating Ceramic Micro-Heat Exchangers by Joining Components; Index 330 $aJoining remains an enabling technology in several key areas related to the use of ceramics. Development of ceramic materials for electronic, biomedical, power generation, and many other fields continues at a rapid pace. Joining of ceramics is a critical issue in the integration of ceramic components in engineering design. This book includes reviews on the state-of-the-art in ceramic joining, new joining materials and methods, and modeling joint behavior and properties. 410 0$aCeramic transactions ;$vv. 138. 606 $aCeramic materials$xBonding$vCongresses 606 $aCeramic materials$vCongresses 608 $aElectronic books. 615 0$aCeramic materials$xBonding 615 0$aCeramic materials 676 $a620.14 676 $a666 701 $aLewinsohn$b Charles A$0867743 701 $aSingh$b M$g(Mrityunjay)$013684 701 $aLoehman$b Ronald E$0911706 712 02$aAmerican Ceramic Society.$bMeeting$d(104th :$f2002 :$eSaint Louis, Mo.) 712 12$aJoining of Ceramics Symposium 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910143641103321 996 $aAdvances in joining of ceramics$92041664 997 $aUNINA