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010   $a1-280-67311-7
010   $a9786613650047
010   $a1-118-16674-4
010   $a1-118-16672-8
010   $a1-118-16675-2
024 8 $a9786613650047
035   $a(CKB)2670000000166902
035   $a(EBL)818509
035   $a(SSID)ssj0000622811
035   $a(PQKBManifestationID)11435049
035   $a(PQKBTitleCode)TC0000622811
035   $a(PQKBWorkID)10643553
035   $a(PQKB)10528881
035   $a(MiAaPQ)EBC818509
035   $a(CaBNVSL)mat06183551
035   $a(IDAMS)0b000064817eb439
035   $a(IEEE)6183551
035   $a(OCoLC)793103961
035   $a(EXLCZ)992670000000166902
100   $a20151221d2012      uy              
101 0 $aeng
135   $aur|n|---|||||
181   $ctxt
182   $cc
183   $acr
200 10$aElectrical modeling and design for 3D system integration $e3D integrated circuits and packaging, signal integrity, power integrity and EMC /$fEr-Ping Li
210  1$a[United States] :$cIEEE Press ;$aHoboken [New Jersey] :$cWiley,
210  2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2012]
215   $a1 online resource (390 p.)
300   $aDescription based upon print version of record.
311   $a0-470-62346-2 
320   $aIncludes bibliographical references and index.
327   $aMacromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
330   $a New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems  Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and 
606   $aThree-dimensional integrated circuits
606   $aIntegrated circuits
615  0$aThree-dimensional integrated circuits.
615  0$aIntegrated circuits.
676   $a621.3015118
686   $aTEC008050$2bisacsh
700   $aLi$b Er-Ping$0845931
801  0$bCaBNVSL
801  1$bCaBNVSL
801  2$bCaBNVSL
906   $aBOOK
912   $a9910141296603321
996   $aElectrical modeling and design for 3D system integration$91888810
997   $aUNINA