LEADER 01007cam0-22003731i-450- 001 990006065790403321 005 20110627155644.0 035 $a000606579 035 $aFED01000606579 035 $a(Aleph)000606579FED01 035 $a000606579 100 $a20000112d1966----km-y0itay50------ba 101 1 $aita$ceng 102 $aIT 105 $ay-------001yy 200 1 $aNietzsche$el'uomo e la sua filosofia$fR. J. Hollingdale 210 $aRoma$cUbaldini$d1966 215 $a306 p.$d24 cm 225 1 $aUlisse$v3 300 $aTraduzione di Giuseppe Sardelli 676 $a141.43$v20$zita 700 1$aHollingdale,$bR. J.$0224477 702 1$aSardelli,$bGiuseppe 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990006065790403321 952 $aXI Q 55 (3)$b87273$fFGBC 952 $aP.1 8D NIET/S 31$bST.FIL.3221$fFLFBC 952 $aBIB. BAT. 539$b4679$fBAT 959 $aBAT 959 $aFLFBC 959 $aFGBC 996 $aNietzsche$989504 997 $aUNINA LEADER 05582nam 2200673 450 001 9910788103703321 005 20220103163348.0 035 $a(CKB)2670000000617882 035 $a(EBL)2056911 035 $a(SSID)ssj0001548973 035 $a(PQKBManifestationID)16154235 035 $a(PQKBTitleCode)TC0001548973 035 $a(PQKBWorkID)14802857 035 $a(PQKB)10306304 035 $a(Au-PeEL)EBL2056911 035 $a(CaPaEBR)ebr11058676 035 $a(CaONFJC)MIL788494 035 $a(OCoLC)910159095 035 $a(MiAaPQ)EBC2056911 035 $a(EXLCZ)992670000000617882 100 $a20150123h20152015 uy| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aRobust design of microelectronics assemblies against mechanical shock, temperature and moisture /$fE-H Wong, Y.-W Mai 210 1$aBoston, MA :$cElsevier,$d[2015] 210 4$dİ2015 215 $a1 online resource (477 p.) 225 1 $aWoodhead Publishing series in electronic and optical materials,$x2050-1501 ;$vnumber 81 300 $aDescription based upon print version of record. 311 $a0-85709-911-6 311 $a1-84569-528-3 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ...; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1 - Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1 - Advances in robust design against temperature-induced failures; 2 - Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals 327 $a2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3 - Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References 327 $aPart 2 - Advances in robust design against moisture-induced failures4 - Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5 - Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3 - Robust design against drop impact 327 $a6 - The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7 - Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8 - Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9 - Fatigue crack growth in solder joints at high strain rate 327 $a9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10 - Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test 327 $a10.3 Analytical solutions for a spring-mass system subjected to half-sine shock 330 $aRobust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful progr 410 0$aWoodhead Publishing series in electronic and optical materials ;$vno 81. 606 $aMicroelectronics$xDesign 606 $aIndustrial design 606 $aRobust control 615 0$aMicroelectronics$xDesign. 615 0$aIndustrial design. 615 0$aRobust control. 676 $a621.381046 700 $aWong$b E- H.$01531499 702 $aMai$b Y.-W. 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910788103703321 996 $aRobust design of microelectronics assemblies against mechanical shock, temperature and moisture$93777218 997 $aUNINA LEADER 01742oam 2200433zu 450 001 9910141042003321 005 20241212220020.0 010 $a9780769542287 010 $a076954228X 035 $a(CKB)2670000000070582 035 $a(SSID)ssj0000527916 035 $a(PQKBManifestationID)12188348 035 $a(PQKBTitleCode)TC0000527916 035 $a(PQKBWorkID)10526454 035 $a(PQKB)11264142 035 $a(NjHacI)992670000000070582 035 $a(EXLCZ)992670000000070582 100 $a20160829d2010 uy 101 0 $aeng 135 $aur||||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$a2010 IEEE 12th Conference on Commerce and Enterprise Computing 210 31$a[Place of publication not identified]$cIEEE$d2010 215 $a1 online resource (xii, 222 pages) $cillustrations 300 $aBibliographic Level Mode of Issuance: Monograph 311 08$a9781424484331 311 08$a1424484332 327 $aSession 1: E-Commerce and Enterprise Architectures -- Session 2: E-Commerce Economics -- Session 3: Business Process Management -- Session 4: Models in E-Commerce and Enterprise Computing -- Session 5: Decision Support in E-Commerce -- Session 6: Security and Trust -- CEC 2010 Short Paper Sessions -- Session 7: Economic Issues -- Session 8: IT Issues in E-Commerce and Enterprise Computing -- Session 9: Knowledge Management -- Session 10: Privacy and Trust. 606 $aElectronic commerce$vCongresses 615 0$aElectronic commerce 676 $a658.872 702 $aIEEE Staff 801 0$bPQKB 906 $aPROCEEDING 912 $a9910141042003321 996 $a2010 IEEE 12th Conference on Commerce and Enterprise Computing$92406106 997 $aUNINA