LEADER 05001nam 2200637 a 450 001 9910139244403321 005 20230725021538.0 010 $a1-118-55766-2 010 $a1-299-31552-6 010 $a1-118-62123-9 035 $a(CKB)2560000000100633 035 $a(EBL)1143629 035 $a(OCoLC)830161630 035 $a(SSID)ssj0000833569 035 $a(PQKBManifestationID)11501405 035 $a(PQKBTitleCode)TC0000833569 035 $a(PQKBWorkID)10936111 035 $a(PQKB)10729603 035 $a(MiAaPQ)EBC1143629 035 $a(Au-PeEL)EBL1143629 035 $a(CaPaEBR)ebr10671590 035 $a(CaONFJC)MIL462802 035 $a(EXLCZ)992560000000100633 100 $a20101013d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aLithography$b[electronic resource] $emain techniques /$fedited by Stefan Landis 210 $aLondon $cISTE ;$aHoboken, N.J. $cWiley$d2011 215 $a1 online resource (405 p.) 225 1 $aISTE 300 $aAdapted and updated from Lithography published 2010 in France by Hermes Science/Lavoisier. 311 $a1-84821-202-X 320 $aIncludes bibliographical references and index. 327 $aCover; Title Page; Copyright Page; Table of Contents; Foreword; Introduction; Chapter 1. Photolithography; 1.1. Introduction; 1.2. Principles and technology of scanners; 1.2.1. Illumination; 1.2.2. The mask or reticle; 1.2.3. Projection optics; 1.2.4. Repeated projection and scanning projection; 1.3. Lithography processes; 1.3.1. Anti-reflective coating; 1.3.2. Resists; 1.3.3. Barrier layers or ""top coating""; 1.4. Immersion photolithography; 1.4.1. Immersion lithography; 1.4.2. Resolution improvement; 1.4.3. Relevance of immersion lithography; 1.4.4. Immersion liquids 327 $a1.4.5. Immersion scanners1.4.6. Immersion specific constraints and issues; 1.5. Image formation; 1.6. Lithography performances enhancement techniques; 1.6.1. Off axis illumination (OAI); 1.6.2. Optical proximity corrections (OPC); 1.6.3. Phase shift masks (PSM); 1.7. Contrast; 1.7.1. Polarized light contrast; 1.7.2. Influence of contrast on roughness; 1.8. Bibliography; Chapter 2. Extreme Ultraviolet Lithography; 2.1. Introduction to extreme ultraviolet lithography; 2.1.1. Chapter introduction 327 $a2.1.2. Extreme ultraviolet lithography: the successor of optical lithography at 248 nm and 193 nm wavelengths2.1.3. The spectral range of extreme ultraviolet; 2.1.4. Choice of wavelength and resolution limit for EUV lithography; 2.2. The electromagnetic properties of materials and the complex index; 2.2.1. Wave vector and complex index; 2.2.2. Scattering and absorption: the electromagnetic origin of the refractive index; 2.2.3. Light propagation and refractive index; 2.2.4. Reflection and transmission of a monochromatic wave; 2.3. Reflective optical elements for EUV lithography 327 $a2.3.1. The interferential mirror principle: Bragg structure2.3.2. Reflective optics: conception and fabrication; 2.3.3. Projection optics for EUV lithography; 2.4. Reflective masks for EUV lithography; 2.4.1. Different mask types; 2.4.2. Manufacturing processes for EUV masks; 2.4.3. Mask defectivity; 2.5. Modeling and simulation for EUV lithography; 2.5.1. Simulation, a conceptional tool; 2.5.2. Simulation methods; 2.6. EUV lithography sources; 2.6.1. Constitutive elements of a plasma source; 2.6.2. Specifications for an EUV source; 2.6.3. EUV sources; 2.7. Conclusion 327 $a2.8. Appendix: Kramers-Kro?nig relationship2.9. Bibliography; Chapter 3. Electron Beam Lithography; 3.1. Introduction; 3.2. Different equipment, its operation and limits: current and future solutions; 3.2.1. Gaussian beam; 3.2.2. Shaped electron beam; 3.2.3. Multi-electron beam; 3.3. Maskless photolithography; 3.3.1. Optical lithography without a mask; 3.3.2. Charged particle maskless lithography; 3.4. Alignment; 3.5. Electron-sensitive resists; 3.6. Electron-matter interaction; 3.7. Physical effect of electronic bombardment in the target; 3.7.1. Polymerizing, chemical bond breaking 327 $a3.7.2. Thermal effect 330 $a"Lithography is now a complex tool at the heart of a technological process for manufacturing micro and nanocomponents. A multidisciplinary technology, lithography continues to push the limits of optics, chemistry, mechanics, micro and nano-fluids, etc. This book deals with essential technologies and processes, primarily used in industrial manufacturing of microprocessors and other electronic components"--$cProvided by publisher. 410 0$aISTE 606 $aMicrolithography 615 0$aMicrolithography. 676 $a621.3815/31 686 $aTEC021000$2bisacsh 701 $aLandis$b Stefan$0907080 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910139244403321 996 $aLithography$92242020 997 $aUNINA LEADER 03997nam 2200385 450 001 9910485552703321 005 20240215025527.0 024 7 $a10.978.8815/366870 035 $a(CKB)4100000011960917 035 $a(NjHacI)994100000011960917 035 $a(EXLCZ)994100000011960917 100 $a20240215d2021 uy 0 101 0 $aita 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aRicomporre i divari $ePolitiche e progetti territoriali contro le disuguaglianze e per la transizione ecologica /$fAlessandro Coppola [and four others] 210 1$aBologna :$cSocieta? editrice il Mulino Spa,$d2021. 215 $a1 online resource (392 pages) $cillustrations 311 $a88-15-36687-3 327 $aCredits -- Nota dei curatori -- Alessandro Coppola, Arturo Lanzani e Federico Zanfi -- Matteo Del Fabbro -- Introduzione. Percorsi possibili per attingere al potenziale inespresso dei luoghi -- Alessandro Balducci, Sara Caramaschi, Alessandro Coppola, Francesco Curci, Grazia Di Giovanni, Matteo di Venosa, Cora Fontana, Gianfranco Franz e Andrea Gritti -- Nei territori sismici: principi fondamentali per una legge quadro per le ricostruzioni -- Francesco Curci, Mariavaleria Mininni, Gabriele Nanni, Edoardo Zanchini e Federico Zanfi -- Gianfranco Becciu, Arturo Lanzani e Federico Zanfi -- Marcello Magoni, Gloria Pessina e Rachele Radaelli -- Arturo Lanzani, Daniela De Leo, Cristiana Mattioli, Eugenio Morello e Federico Zanfi -- Gabriele Pasqui, Alessandro Balducci, Alessandro Coppola, Giovanni Laino e Agostino Petrillo -- Gloria Pessina -- Silvia Erba e Lorenzo Pagliano -- Federico Zanfi, Laura Daglio, Antonio Perrone e Simone Rusci -- Laura Daglio, Elena Marchigiani e Federico Zanfi -- Massimo Bricocoli, Carlo Cellamare, Francesca Cognetti e Elena Marchigiani -- Ezio Micelli e Simone Rusci -- Gloria Pessina -- Giovanni Allegretti, Alessandro Coppola, Enrico Gargiulo, Elena Ostanel, Laura Saija e Michelangelo Secchi -- Angelo Salento, Filippo Barbera e Valeria Fedeli -- Marco Arlotti e Costanzo Ranci -- Maria Raffaella Lamacchia, Daniela Luisi, Cristiana Mattioli, Rocco Pastore, Cristina Renzoni e Paola Savoldi -- Carolina Pacchi e Costanzo Ranci -- Paolo Galuzzi e Arturo Lanzani -- Lucina Caravaggi, Arturo Lanzani e Antonio Longo -- Arturo Lanzani, Antonio Longo, Cristina Renzoni e Federico Zanfi -- Matteo Del Fabbro -- Paolo Bozzuto, Lorenzo Fabian, Paolo Gandolfi, Stefano Munarin e Luca Velo -- Fabrizio Barca -- Gabriele Pasqui. 330 $aCome si manifestano nel territorio italiano le disuguaglianze sociali e spaziali? Quali intrecci con le crisi e i rischi ambientali producono queste geografie? Quali azioni sono necessarie per affrontare tali fenomeni in modo strutturale e coordinato? Il volume - frutto di un percorso di riflessione che ha coinvolto studiosi, amministratori, esperti e attivisti - si propone di rispondere a questi interrogativi formulando idee progettuali che si articolano su scale e ambiti d'intervento diversi, con un'attenzione particolare al ruolo degli specifici assetti materiali e fisici del nostro paese. Le proposte qui raccolte riguardano strategie territoriali nazionali e temi quali l'abitare, le infrastrutture della vita quotidiana e la mobilita?. Tali proposte interpretano il contrasto alle disuguaglianze e il sostegno alla transizione ecologica delle economie e dei territori come due facce di una stessa medaglia, e guardano all'orizzonte degli investimenti che l'Italia si accinge a predisporre anche nel quadro d'azione del programma Next Generation EU. 517 $aRicomporre i divari 606 $aSociology$y21st century 615 0$aSociology 676 $a301.07204977 700 $aCoppola$b Alessandro$0522912 702 $aDel Fabbro$b Matteo 801 0$bNjHacI 801 1$bNjHacl 906 $aBOOK 912 $a9910485552703321 996 $aRicomporre i divari$93911880 997 $aUNINA