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200 10$a10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems $e26-29 April 2009, Delft, Netherlands /$fInstitute of Electrical and Electronics Engineers
210  1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2009.
215   $a1 online resource (114 pages)
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a1-4244-4159-5 
311   $a1-4244-4160-9 
606   $aIntegrated circuits$xSimulation methods$vCongresses
606   $aMicroelectronics$xDesign$vCongresses
606   $aMicroelectronics$xSimulation methods$vCongresses
615  0$aIntegrated circuits$xSimulation methods
615  0$aMicroelectronics$xDesign
615  0$aMicroelectronics$xSimulation methods
676   $a621.3815
712 02$aInstitute of Electrical and Electronics Engineers,
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996   $a10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems$92534354
997   $aUNINA