LEADER 05970nam 22007453u 450 001 9910137852403321 005 20230725045353.0 010 $a1-299-31442-2 010 $a0-470-82782-3 010 $a0-470-82781-5 035 $a(CKB)3280000000000225 035 $a(EBL)818629 035 $a(OCoLC)756280855 035 $a(SSID)ssj0000565672 035 $a(PQKBManifestationID)11367216 035 $a(PQKBTitleCode)TC0000565672 035 $a(PQKBWorkID)10532903 035 $a(PQKB)10684069 035 $a(MiAaPQ)EBC818629 035 $a(EXLCZ)993280000000000225 100 $a20130418d2011|||| u|| | 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aModeling and Simulation for Microelectronic Packaging Assembly$b[electronic resource] $eManufacturing, Reliability and Testing 210 $aChicester $cWiley$d2011 215 $a1 online resource (588 p.) 300 $aDescription based upon print version of record. 311 $a0-470-82780-7 327 $aModeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing; Contents; Foreword by C. P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; 1 Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.1.1 Linear Elasticity; 1.1.2 Elastic-Visco-Plasticity; 1.2 Finite Element Method; 1.2.1 Basic Finite Element Equations; 1.2.2 Nonlinear Solution Methods; 1.2.3 Advanced Modeling Techniques in Finite Element Analysis 327 $a1.2.4 Finite Element Applications in Semiconductor Packaging Modeling1.3 Chapter Summary; References; 2 Material and Structural Testing for Small Samples; 2.1 Material Testing for Solder Joints; 2.1.1 Specimens; 2.1.2 A Thermo-Mechanical Fatigue Tester; 2.1.3 Tensile Test; 2.1.4 Creep Test; 2.1.5 Fatigue Test; 2.2 Scale Effect of Packaging Materials; 2.2.1 Specimens; 2.2.2 Experimental Results and Discussions; 2.2.3 Thin Film Scale Dependence for Polymer Thin Films; 2.3 Two-Ball Joint Specimen Fatigue Testing; 2.4 Chapter Summary; References 327 $a3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution3.1 Constitutive Model for Tin-Lead Solder Joint; 3.1.1 Model Formulation; 3.1.2 Determination of Material Constants; 3.1.3 Model Prediction; 3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills; 3.2.1 Constitutive Modeling of Underfills; 3.2.2 Identification of Material Constants; 3.2.3 Model Verification and Prediction; 3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys; 3.3.1 Damage Coupling Thermodynamic Framework 327 $a3.3.2 Large Deformation Formulation3.3.3 Identification of the Material Parameters; 3.3.4 Creep Damage; 3.4 User-Supplied Subroutines for Solders Considering Damage Evolution; 3.4.1 Return-Mapping Algorithm and FEA Implementation; 3.4.2 Advanced Features of the Implementation; 3.4.3 Applications of the Methodology; 3.5 Chapter Summary; References; 4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages; 4.1 Life Prediction Methodology; 4.1.1 Strain-Based Approach; 4.1.2 Energy-Based Approach; 4.1.3 Fracture Mechanics-Based Approach; 4.2 Accelerated Testing Methodology 327 $a4.2.1 Failure Modes via Accelerated Testing Bounds4.2.2 Isothermal Fatigue via Thermal Fatigue; 4.3 Constitutive Modeling Methodology; 4.3.1 Separated Modeling via Unified Modeling; 4.3.2 Viscoplasticity with Damage Evolution; 4.4 Solder Joint Reliability via FEA; 4.4.1 Life Prediction of Ford Joint Specimen; 4.4.2 Accelerated Testing: Insights from Life Prediction; 4.4.3 Fatigue Life Prediction of a PQFP Package; 4.5 Life Prediction of Flip-Chip Packages; 4.5.1 Fatigue Life Prediction with and without Underfill 327 $a4.5.2 Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive Modeling 330 $aAlthough there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people 606 $aMicroelectronic packaging - Simulation methods 606 $aMicroelectronic packaging -- Simulation methods 606 $aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General 606 $aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General 606 $aMicroelectronic packaging$xSimulation methods 606 $aElectrical & Computer Engineering$2HILCC 606 $aEngineering & Applied Sciences$2HILCC 606 $aElectrical Engineering$2HILCC 615 4$aMicroelectronic packaging - Simulation methods. 615 4$aMicroelectronic packaging -- Simulation methods. 615 4$aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General. 615 4$aTECHNOLOGY & ENGINEERING / Electronics / Circuits / General. 615 0$aMicroelectronic packaging$xSimulation methods 615 7$aElectrical & Computer Engineering 615 7$aEngineering & Applied Sciences 615 7$aElectrical Engineering 676 $a621.381046 686 $aTEC008010$2bisacsh 700 $aLiu$b Sheng$0898248 701 $aLiu$b Yong$0720834 801 0$bAU-PeEL 801 1$bAU-PeEL 801 2$bAU-PeEL 906 $aBOOK 912 $a9910137852403321 996 $aModeling and Simulation for Microelectronic Packaging Assembly$92007071 997 $aUNINA