LEADER 03969nam  2200661Ia 450 
001 9910133458303321
005 20230725052455.0
010   $a1-118-06314-7
010   $a1-283-37153-7
010   $a9786613371539
010   $a0-470-60262-7
010   $a0-470-60263-5
035   $a(CKB)3400000000000257
035   $a(EBL)661647
035   $a(OCoLC)792932606
035   $a(SSID)ssj0000477764
035   $a(PQKBManifestationID)11320093
035   $a(PQKBTitleCode)TC0000477764
035   $a(PQKBWorkID)10514061
035   $a(PQKB)10768687
035   $a(MiAaPQ)EBC661647
035   $a(Au-PeEL)EBL661647
035   $a(CaPaEBR)ebr10510261
035   $a(CaONFJC)MIL337153
035   $a(EXLCZ)993400000000000257
100   $a20100504d2010      uy             0
101 0 $aeng
135   $aur|n|---|||||
181   $ctxt
182   $cc
183   $acr
200 00$aModern electroplating$b[electronic resource] /$fedited by Mordechay Schlesinger, Milan Paunovic
205   $a5th ed.
210   $aHoboken, NJ $cWiley$dc2010
215   $a1 online resource (749 p.)
225 0 $aThe ECS series of texts and monographs ;$v52
300   $aDescription based upon print version of record.
311   $a0-470-16778-5 
320   $aIncludes bibliographical references and index.
327   $aMODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
327   $a12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL
327   $a26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX
330   $a The definitive resource for electroplating, now completely up to date  With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers.  With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical app
410  4$aThe ECS Series of Texts and Monographs
606   $aElectroplating
606   $aMetals$xFinishing
615  0$aElectroplating.
615  0$aMetals$xFinishing.
676   $a671.7/32
701   $aPaunovic$b Milan$0563943
701   $aSchlesinger$b Mordechay$0563944
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910133458303321
996   $aModern electroplating$91889314
997   $aUNINA