LEADER 07022nam 2200745Ia 450 001 9910132519303321 005 20230801232741.0 010 $a1-118-55907-X 010 $a1-118-44332-2 010 $a1-118-44326-8 010 $a1-118-44327-6 010 $a1-283-59903-1 035 $a(CKB)3580000000000671 035 $a(StDuBDS)AH24220125 035 $a(SSID)ssj0000737293 035 $a(PQKBManifestationID)11469214 035 $a(PQKBTitleCode)TC0000737293 035 $a(PQKBWorkID)10782478 035 $a(PQKB)10687755 035 $a(OCoLC)809555689 035 $a(MiAaPQ)EBC1021727 035 $a(WaSeSS)Ind00046462 035 $a(Au-PeEL)EBL1021727 035 $a(CaPaEBR)ebr10602092 035 $a(CaONFJC)MIL391148 035 $a(OCoLC)815973422 035 $a(EXLCZ)993580000000000671 100 $a20120621d2012 uy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$aESD basics$b[electronic resource] $efrom semiconductor manufacturing to use /$fSteven H. Voldman 210 $aChichester, West Sussex $cWiley$d2012 215 $a1 online resource (xviii, 208 p. )$cill 225 1 $aESD series 300 $aBibliographic Level Mode of Issuance: Monograph 311 $a0-470-97971-2 320 $aIncludes bibliographical references and index. 330 $aThis title introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. 330 $bElectrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology Semiconductor manufacturing handling and auditing processing to avoid ESD failures ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author's series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era. Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology Semiconductor manufacturing handling and auditing processing to avoid ESD failures ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author's series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era. 410 0$aESD series. 606 $aElectronic apparatus and appliances$xDesign and construction 606 $aElectric discharges 606 $aElectronic apparatus and appliances$xProtection 606 $aMicroelectronics 606 $aStatic eliminators 606 $aElectrostatics 615 0$aElectronic apparatus and appliances$xDesign and construction. 615 0$aElectric discharges. 615 0$aElectronic apparatus and appliances$xProtection. 615 0$aMicroelectronics. 615 0$aStatic eliminators. 615 0$aElectrostatics. 676 $a621.3815 686 $aTEC008010$2bisacsh 700 $aVoldman$b Steven H$0872423 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910132519303321 996 $aESD basics$91947698 997 $aUNINA