LEADER 04050nam 2200589 a 450 001 9910131028103321 005 20230725053052.0 010 $a3-527-63446-0 010 $a3-527-63445-2 010 $a3-527-63444-4 035 $a(CKB)3460000000003453 035 $a(EBL)693857 035 $a(OCoLC)714798786 035 $a(SSID)ssj0000550591 035 $a(PQKBManifestationID)11381812 035 $a(PQKBTitleCode)TC0000550591 035 $a(PQKBWorkID)10509413 035 $a(PQKB)11344975 035 $a(MiAaPQ)EBC693857 035 $a(Au-PeEL)EBL693857 035 $a(CaPaEBR)ebr10713563 035 $a(CaONFJC)MIL494621 035 $a(EXLCZ)993460000000003453 100 $a20120224d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aOrganic thin film transistor integration$b[electronic resource] $ea hybrid approach /$fFlora M. Li ... [et al.] 210 $aWeinheim $cWiley-VCH$dc2011 215 $a1 online resource (272 p.) 300 $aDescription based upon print version of record. 311 $a3-527-40959-9 320 $aIncludes bibliographical references and index. 327 $aCover; About the Authors; Title Page; Copyright; Dedication; Preface; Glossary; Abbreviations; Mathematic Symbols; Definitions; Chapter 1: Introduction; 1.1 Organic Electronics: History and Market Opportunities; References; Chapter 2: Organic Thin Film Transistor (OTFT) Overview; 2.1 Organic Semiconductor Overview; 2.2 OTFT Operation and Characteristics; 2.3 OTFT Device Architecture; 2.4 OTFT Device Material Selection; 2.5 Summary; References; Chapter 3: OTFT Integration Strategies; 3.1 Technological Challenge in OTFT Integration; 3.2 Overview of Processing and Fabrication Techniques 327 $a3.3 OTFT Fabrication Schemes3.4 Summary and Contributions; References; Chapter 4: Gate Dielectrics by Plasma Enhanced Chemical Vapor Deposition (PECVD); 4.1 Overview of Gate Dielectrics; 4.2 Experimental Details and Characterization Methods; 4.3 Material Characterization of PECVD SiNx Films; 4.4 Electrical Characterization of OTFTs with PECVD Gate Dielectric; 4.5 Summary and Contributions; References; Chapter 5: Dielectric Interface Engineering; 5.1 Background; 5.2 Experimental Details; 5.3 Impact of Dielectric Surface Treatments; 5.4 Impact of Oxygen Plasma Exposure Conditions 327 $a5.5 Summary and ContributionsReferences; Chapter 6: Contact Interface Engineering; 6.1 Background; 6.2 Experimental Details; 6.3 Impact of Contact Surface Treatment by Thiol SAM; 6.4 Impact of Execution Sequence of Surface Treatment; 6.5 Summary and Contributions; References; Chapter 7: OTFT Circuits and Systems; 7.1 OTFT Requirements for Circuit Applications; 7.2 Applications; 7.3 Circuit Demonstration; 7.4 Summary, Contributions, and Outlook; References; Chapter 8: Outlook and Future Challenges; 8.1 Device Performance; 8.2 Device Manufacture; 8.3 Device Integration; References; Index 330 $aResearch on organic electronics (or plastic electronics) is driven by the need to create systems that are lightweight, unbreakable, and mechanically flexible. With the remarkable improvement in the performance of organic semiconductor materials during the past few decades, organic electronics appeal to innovative, practical, and broad-impact applications requiring large-area coverage, mechanical flexibility, low-temperature processing, and low cost. Thus, organic electronics appeal to a broad range of electronic devices and products including transistors, diodes, sensors, solar cells, lighting 606 $aOrganic thin films 606 $aOrganic semiconductors 615 0$aOrganic thin films. 615 0$aOrganic semiconductors. 676 $a621.381528 701 $aLi$b F. M$g(Flora M.)$0943488 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910131028103321 996 $aOrganic thin film transistor integration$92129400 997 $aUNINA