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101 0 $aeng
135   $aur|||||||||||
181   $ctxt
182   $cc
183   $acr
200 10$a2012 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference
210 31$a[Place of publication not identified]$cIEEE$d2012
215   $a1 online resource
300   $aBibliographic Level Mode of Issuance: Monograph
311 08$a9781467303507 
311 08$a146730350X 
327   $aASMC 2012 proceedings produced by: semi [advertisement] -- Organizing Committee -- Corporate sponsors -- Table of contents -- Identifying systematic critical features using silicon diagnosis data -- Using selective voltage binning to maximize yield -- Analytic modeling of AC response to FET-level elements for CLY optimization -- Optimizing product yield using manufacturing defect weights -- Improving yield learning by electrical fault inspection -- Innovative approach to identify location of AMC source in cleanroom by inverse Computational Fluid Dynamics modeling -- Managing variability within wafertest production by combining lean and six sigma.
606   $aProcess control$vCongresses
606   $aSemiconductor industry$xManagement
615  0$aProcess control
615  0$aSemiconductor industry$xManagement.
676   $a658.562
702   $aIEEE Staff
801  0$bPQKB
906   $aPROCEEDING
912   $a9910130718603321
996   $a2012 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference$92508633
997   $aUNINA