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200 10$a2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
210 31$a[Place of publication not identified]$cIEEE$d2012
215   $a1 online resource (262 pages) $cillustrations
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606   $aPhotonics$xMaterials$vCongresses
606   $aThree-dimensional integrated circuits
606   $aSealing (Technology)$vCongresses
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996   $a2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration$92509919
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