LEADER 00984nam0-22003371i-450- 001 990003904690403321 005 20080131094138.0 010 $a0-415-21291-X 035 $a000390469 035 $aFED01000390469 035 $a(Aleph)000390469FED01 035 $a000390469 100 $a20030910d2000----km-y0itay50------ba 101 0 $aeng 102 $aGB 105 $a--------001cy 200 1 $aSurvival of the european welfare state$fedited by Stein Kuhnle 210 $aLondon$cRoutledge$dc2000 215 $a246 p.$ctab., fig.$d24 cm 225 1 $aRoutledge/ECPR studies in European political science$v14 320 $aContiene riferimenti bibl. 610 0 $aSTATO SOCIALE$aEuropa 676 $a361.65094$v21$zita 702 1$aKuhnle,$bStein 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990003904690403321 952 $a361.65094 KUH 1$b1011$fBFS 959 $aBFS 996 $aSurvival of the european welfare state$9516622 997 $aUNINA LEADER 04799nam 2200637Ia 450 001 9910461456403321 005 20200520144314.0 010 $a1-61122-123-4 035 $a(CKB)2670000000092425 035 $a(EBL)3018148 035 $a(SSID)ssj0000523915 035 $a(PQKBManifestationID)11341041 035 $a(PQKBTitleCode)TC0000523915 035 $a(PQKBWorkID)10543273 035 $a(PQKB)11409334 035 $a(MiAaPQ)EBC3018148 035 $a(Au-PeEL)EBL3018148 035 $a(CaPaEBR)ebr10659070 035 $a(OCoLC)923657261 035 $a(EXLCZ)992670000000092425 100 $a20100820d2011 uy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 00$aLithography$b[electronic resource] $eprinciples, processes and materials /$fTheodore C. Hennessy, editor 210 $aNew York $cNova Science$dc2011 215 $a1 online resource (299 p.) 225 1 $aEngineering tools, techniques and tables 225 1 $aNanotechnology science and technology 300 $aDescription based upon print version of record. 311 $a1-61761-837-3 320 $aIncludes bibliographical references and index. 327 $a""LITHOGRAPHY:PRINCIPLES, PROCESSES AND MATERIALS""; ""CONTENTS""; ""PREFACE""; ""PRINCIPLE, PROCESSES AND MATERIALS FOR NANO IMPRINT LITHOGRAPHY""; ""1. INTRODUCTION""; ""2. PRINCIPLE AND FUNDAMENTAL PROCESS FOR NIL""; ""2.1. Principle of NIL""; ""2.2. Theoretical Analysis for NIL""; ""2.3. Fundamental Process for NIL""; ""3. VARIATIONS OF NIL PROCESSES""; ""3.1. Combined Thermal and UV-NIL""; ""3.2. Reverse Imprint Process""; ""3.3. Laser-Assisted Direct Imprint""; ""3.4. Roll Imprint Process""; ""3.5. Substrate Conformal Imprint Lithography (SCIL)""; ""3.6. Large Area Imprint"" 327 $a""3.7. Nanoelectrode Lithography""""3.8. Hybrid NIL Process""; ""3.9. Metal Nanoparticle Nanoimprinting Process""; ""3.10. High Resolution NIL""; ""3.11. Other NIL Processes""; ""4. NIL MATERIALS""; ""4.1. NIL Resists""; ""4.2. Functional Materials and Other Imprintable Materials""; ""4.3. Mold Materials""; ""5. PROSPECTS AND CHALLENGES IN NIL""; ""6. CONCLUSION""; ""ACKNOWLEDGMENTS""; ""REFERENCES""; ""NANOFABRICATION IN ELECTRONBEAM LITHOGRAPHY""; ""1. ELECTRON BEAM LITHOGRAPHY OVERVIEW""; ""1.1. Introduction to the Electron Beam Lithography System""; ""1.2. Proximity Effect"" 327 $a""1.3. Numerical Calculation of the E-beam (Monte Carlo Method)""""2. CARBON NANOTUBE (CNT) BASED DEVICES""; ""2.1.Introduction to carbon nanotubes ""; ""2.2. VACNT Based FE Device with Individual Cathode Structures""; ""2.3. Field Emission Properties of Single Vertically Aligned Carbon Nanotubes""; ""2. VARIO""; ""2.4. Application in Micro CNT Column System""; ""3. FABRICATION OF 3D NANOSTRUCTURES ON CYLINDRICAL ROLLERS""; ""3.1. Introduction to Nanolithography""; ""3.2. In-House Field Emission Measurement Facility""; ""4. CONCLUSIONS""; ""ACKNOWLEDGMENT""; ""REFERENCES"" 327 $a""GENERATION OF MICRO PATTERNS ONSIDE SURFACES OF POLYMER AND SISUBSTRATES USING A MICROPUNCHING LITHOGRAPHY APPROACH""""ABSTRACT""; ""1. INTRODUCTION""; ""2. MACROPUNCHING METHOD AND MPL""; ""3. AU SIDEWALL PATTERNS ON HDPE CHANNELS""; ""3.1. Fabrication Procedure""; ""3.2. Experimental Results and Discussions""; ""4. SUPER HYDROPHOBIC PDMS CHANNELS""; ""4.1. Fabrication Process""; ""4.2. Experimental Results and Discussions""; ""5. FABRICATION OF AU DOTS ON SI SIDEWALLS""; ""5.1. Fabrication Procedures""; ""5.2. Results and Discussions""; ""6. SUMMARY AND CONCLUSIONS""; ""ACKNOWLEDGMENTS"" 327 $a""REFERENCES""""LITHOGRAPHY: PRINCIPLES,PROCESSES AND MATERIALS""; ""ABSTRACT""; ""1. INTRODUCTION""; ""2. PRINCIPLE OF LITHOGRAPHY""; ""3. PROCESSES OF LITHOGRAPHY""; ""3.1. RIE-NSL Lithography [32]""; ""3.2. FIB Lithography""; ""3.3. Laser Interference Lithography""; ""4. MATERIALS OF LITHOGRAPHY""; ""4.1. Materials of RIE-NSL Lithography""; ""4.2. Materials of FIB Lithography""; ""4.3. Materials of Laser Interference Lithography""; ""5. CONCLUSIONS""; ""REFERENCES""; ""LASER INTERFERENCE LITHOGRAPHY""; ""ABSTRACT""; ""1. INTRODUCTION""; ""2. THEORY""; ""3. INSTRUMENTATION"" 327 $a""3.1. Choice of Laser"" 410 0$aEngineering tools, techniques and tables. 410 0$aNanotechnology science and technology series. 606 $aMicrolithography 606 $aMicrofabrication 608 $aElectronic books. 615 0$aMicrolithography. 615 0$aMicrofabrication. 676 $a621.3815/31 701 $aHennessy$b Theodore C$0890639 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910461456403321 996 $aLithography$91989487 997 $aUNINA