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005 20220915110557.177
017 70$2N$a978-981-16-1376-0
100   $a20220915d2021       |0itac50      ba
101   $aeng
102   $aSG
105   $a||||    |||||
200 1 $aSemiconductor Advanced Packaging$fJohn H. Lau
210   $aSingapore$cSpringer$d2021
215   $aXXII, 498 p.$cill.$d24 cm
620   $aSG$dSingapore$3VANL000061
700  1$aLau$bJohn H.$3VANV204531$0972648
712   $aSpringer <editore>$3VANV108073$4650
801   $aIT$bSOL$c20240614$gRICA
856 4 $uhttps://doi.org/10.1007/978-981-16-1376-0$zE-book ? Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o Shibboleth
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996   $aSemiconductor Advanced Packaging$92212364
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