LEADER 01192nam0 2200301 i 450 
001 VAN0108306
005 20230621025333.921
010   $a978-14-939155-5-2
017 70$2N$a9781493915569
100   $a20170306d2015       |0itac50      ba
101   $aeng
102   $aUS
105   $a||||    |||||
200 1 $aWafer-Level Chip-Scale Packaging$eAnalog and Power Semiconductor Applications$f Shichun Qu, Yong Liu
210   $aNew York$cSpringer$d2015
215   $axvii, 322 p.$d24 cm
620   $aUS$dNew York$3VANL000011
700  1$aQu$bShichun$3VANV083634$0720835
701  1$aLiu$bYong$3VANV083635$0720834
712   $aSpringer <editore>$3VANV108073$4650
801   $aIT$bSOL$c20240614$gRICA
856 4 $uhttps://link.springer.com/book/10.1007%2F978-1-4939-1556-9$zE-book ? Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o Shibboleth
899   $aBIBLIOTECA CENTRO DI SERVIZIO SBA$2VAN15
912   $fN
912   $aVAN0108306
950   $aBIBLIOTECA CENTRO DI SERVIZIO SBA$d15CONS      SBA EBOOK 722                       $e15EB 722               20170306            
996   $aWafer-Level Chip-Scale Packaging$91412832
997   $aUNICAMPANIA