LEADER 02602nam0 22005173i 450 001 VAN00285781 005 20250401090703.268 017 70$2N$a9789811992674 100 $a20250129d2023 |0itac50 ba 101 $aeng 102 $aSG 105 $a|||| ||||| 181 $ai$b e 182 $ab 183 $acr 200 1 $aProceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium$eEPITS 2022, 14-15 September, Langkawi, Malaysia$fMohd Arif Anuar Mohd Salleh ... [et al.] editors 210 $aSingapore$cSpringer$d2023 215 $axli, 875 p.$cill.$d24 cm 410 1$1001VAN00132747$12001 $aSpringer Proceedings in Physics$1210 $aBerlin [etc.]$cSpringer$d1984-$v289 606 $a00A79 (77-XX)$xPhysics [MSC 2020]$3VANC023182$2MF 606 $a91-XX$xGame theory, economics, finance, and other social and behavioral sciences [MSC 2020]$3VANC025601$2MF 606 $a91B76$xEnvironmental economics (natural resource models, harvesting, pollution, etc.) [MSC 2020]$3VANC030910$2MF 610 $aAdvanced Materials$9KW:K 610 $aAutomotive electronics$9KW:K 610 $aInterconnect materials$9KW:K 610 $aNon-solder interconnect materials$9KW:K 610 $aPb-free solders$9KW:K 610 $aPower electronics$9KW:K 610 $aSurface coating materials$9KW:K 620 $aSG$dSingapore$3VANL000061 702 1$aSalleh$bMohd A. A.$3VANV215741$4340 710 12$aGreen Materials and Electronic Packaging Interconnect Technology Symposium$f2022$eLangkawi, Malaysia$3VANV239731$01783255 712 $aSpringer $3VANV108073$4650 790 1$aMohd Arif Anuar, Mohd Salleh$zSalleh, Mohd A. A.$3VANV215742 790 1$aSalleh, M.A.A.M.$zSalleh, Mohd A. A.$3VANV215743 790 1$aSalleh, M. A. A. M.$zSalleh, Mohd A. A.$3VANV215744 790 1$aSalleh, Mohd Arif Anuar$zSalleh, Mohd A. A.$3VANV236985 790 1$aSalleh, Mohd A.A.$zSalleh, Mohd A. A.$3VANV236986 801 $aIT$bSOL$c20250404$gRICA 856 4 $uhttps://doi.org/10.1007/978-981-19-9267-4$zE-book ? Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o Shibboleth 899 $aBIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA$1IT-CE0120$2VAN08 912 $fN 912 $aVAN00285781 950 $aBIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA$d08DLOAD e-Book 10469 $e08eMF10469 20250212 996 $aProceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium$94310580 997 $aUNICAMPANIA