LEADER 01294nam0 22003133i 450 
001 VAN00244568
005 20240806101401.940
017 70$2N$a978-981-15-7090-2
100   $a20220411d2021       |0itac50      ba
101   $aeng
102   $aSG
105   $a||||    |||||
200 1 $a3D Microelectronic Packaging$eFrom Architectures to Applications$fYan Li, Deepak Goyal editors
205   $aSecond Edition
210   $aSingapore$cSpringer$d2021
215   $aXVI, 477 p.$cill.$d24 cm
410  1$1001VAN00063131$12001 $aSpringer series in advanced microelectronics$1210  $aBerlin [etc.]$cSpringer$v64
620   $aSG$dSingapore$3VANL000061
702  1$aGoyal$bDeepak$3VANV199737
702  1$aLi$bYan$3VANV097602
712   $aSpringer <editore>$3VANV108073$4650
801   $aIT$bSOL$c20240906$gRICA
856 4 $uhttps://link.springer.com/book/10.1007/978-981-15-7090-2$zE-book ? Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o Shibboleth
899   $aBIBLIOTECA CENTRO DI SERVIZIO SBA$2VAN15
912   $fN
912   $aVAN00244568
950   $aBIBLIOTECA CENTRO DI SERVIZIO SBA$d15CONS      SBA EBOOK 8846                      $e15EB 8846              20220411            
996   $a3D Microelectronic Packaging$91934663
997   $aUNICAMPANIA