LEADER 01329nam0 2200325 i 450 
001 SUN0127389
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010   $d0.00
017 70$2N$a978-981-32-9531-5
100   $a20200309d2019       |0engc50      ba
101   $aeng
102   $aSG
105   $a||||    |||||
200 1 $a*Transactions on Engineering Technologies$eWorld Congress on Engineering 2018$fSio-Iong Ao, Len Gelman, Haeng Kon Kim editors
205   $aSingapore : Springer, 2019
210   $aix$d363 p.$cill. ; 24 cm
215   $aPubblicazione in formato elettronico
606   $a68Uxx$xComputing methodologies and applications [MSC 2020]$2MF$3SUNC019673
606   $a00-XX$xGeneral and overarching topics; collections [MSC 2020]$2MF$3SUNC025238
620   $aSG$dSingapore$3SUNL000061
702  1$aKim$b, Haeng Kon$3SUNV083476
702  1$aAo$b, Sio-long$3SUNV083478
702  1$aGelman$b, Len$3SUNV083481
712   $aSpringer$3SUNV000178$4650
801   $aIT$bSOL$c20210503$gRICA
856 4 $uhttp://doi.org/10.1007/978-981-32-9531-5
912   $aSUN0127389
950   $aUFFICIO DI BIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA$d08CONS      e-book                  1874        $e08eMF1874              20200309            
996   $aTransactions on Engineering Technologies$91412945
997   $aUNICAMPANIA