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001 SUN0108306
005 20170306114917.364
010   $a8-1-4939-1555-2$d0.00
017 70$2N$a978-1-4939-1556-9
100   $a20170306d2015       |0engc50      ba
101   $aeng
102   $aUS
105   $a||||    |||||
200 1 $a*Wafer-Level Chip-Scale Packaging$eAnalog and Power Semiconductor Applications$f Shichun Qu, Yong Liu
205   $aNew York : Springer, 2015
210   $axvii$d322 p. ; 24 cm
215   $aPubblicazione in formato elettronico
620   $aUS$dNew York$3SUNL000011
700  1$aQu$b, Shichun$3SUNV083634$0720835
701  1$aLiu$b, Yong$3SUNV083635$0720834
712   $aSpringer$3SUNV000178$4650
801   $aIT$bSOL$c20200921$gRICA
856 4 $uhttps://link.springer.com/book/10.1007%2F978-1-4939-1556-9
912   $aSUN0108306
950   $aBIBLIOTECA CENTRO DI SERVIZIO SBA$d15CONS      SBA EBOOK 722                       $e15EB 722               20170306            
996   $aWafer-Level Chip-Scale Packaging$91412832
997   $aUNICAMPANIA