LEADER 01360nam0 2200301 i 450 001 SUN0016305 005 20180413102004.57 010 $a978-88-214-0067-4$d0.00 100 $a20040520d1989 |0itac50 ba 101 $aita 102 $aIT 105 $a|||| ||||| 200 1 $a*Esercizi di meccanica razionale$fBruno Finzi, Paolo Udeschini 205 $a4. ed 210 $aMilano$cMasson$d1989 215 $aVIII, 563 p.$cill.$d24 cm. 606 $a70-XX$xMechanics of particles and systems [MSC 2020]$2MF$3SUNC021390 620 $dMilano$3SUNL000284 700 1$aFinzi$b, Bruno$3SUNV012075$0770 701 1$aUdeschini$b, Paolo$3SUNV012076$0772 712 $aMasson $3SUNV000050$4650 801 $aIT$bSOL$c20200720$gRICA 912 $aSUN0016305 950 $aUFFICIO DI BIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA$d08CONS 70-XX 1391 $e08 2083 I a 20040526 950 $aUFFICIO DI BIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA$d08PREST 70-XX 1391 $e08 2084 I b 20061115 950 $aUFFICIO DI BIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA$d08PREST 70-XX 1391 $e08 2426 I c 20061115 996 $aEsercizi di meccanica razionale$933250 997 $aUNICAMPANIA LEADER 04629nam 2200577 a 450 001 9910452751103321 005 20200520144314.0 010 $a1-68015-512-1 010 $a1-61503-995-3 035 $a(CKB)2550000001039745 035 $a(EBL)3002469 035 $a(SSID)ssj0001178381 035 $a(PQKBManifestationID)11764374 035 $a(PQKBTitleCode)TC0001178381 035 $a(PQKBWorkID)11168570 035 $a(PQKB)11048187 035 $a(MiAaPQ)EBC3002469 035 $a(Au-PeEL)EBL3002469 035 $a(CaPaEBR)ebr10627944 035 $a(OCoLC)929147927 035 $a(EXLCZ)992550000001039745 100 $a20121211d2012 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aISTFA 2012$b[electronic resource] $econference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA 210 $aMaterials Park, Ohio $cASM International$d2012 215 $a1 online resource (642 p.) 300 $aDescription based upon print version of record. 311 $a1-61503-979-1 320 $aIncludes bibliographical references and index. 327 $a""Title Page""; ""Copyright""; ""Board of Directors""; ""Organizing Committee""; ""Symposium Committee""; ""User Groups""; ""Contents""; ""2012 IPFA Best Paper""; ""Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI""; ""Emerging Concepts and Techniques""; ""Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics""; ""Fault Isolation of Open Defects Using Space Domain Reflectometry""; ""Localization of Dead Open in a Solder Bump by Space Domain Reflectometry"" 327 $a""Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package""""Novel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal""; ""FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices""; ""Fault Isolation and Failure Analysis of TSV""; ""Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling""; ""Microstructural Considerations on the Reliability of 3D Packaging"" 327 $a""High-Frequency TSV Failure Detection Method with Z Parameter""""Enhanced Failure Analysis on Open TSV Interconnects""; ""Nanoprobing Techniques""; ""A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging""; ""Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing""; ""In FAB 300 mm Wafer Level Atomic Force Probe Characterization""; ""Nanoelectronic Analog Circuit PFA a??? The Return of Circuit Level Probing""; ""Fault Isolation and Failure Analysis of 3D Packages"" 327 $a""Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in Packages""""Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography""; ""Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies""; ""Nanoprobing Applications""; ""Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology"" 327 $a""Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 Nanoprobes""""Leaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis""; ""Photon Based Techniques: An Understanding""; ""Photon Emission Spectra of FETs as Obtained by InGaAs Detector""; ""Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies"" 327 $a""Characterization and TCAD Simulation of 90 nm Technology PMOS Transistor Under Continuous Photoelectric Laser Stimulation for Failure Analysis Improvement"" 606 $aElectronics$xMaterials$xTesting$vCongresses 606 $aElectronic apparatus and appliances$xTesting$vCongresses 608 $aElectronic books. 615 0$aElectronics$xMaterials$xTesting 615 0$aElectronic apparatus and appliances$xTesting 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910452751103321 996 $aISTFA 2012$92267912 997 $aUNINA