01081cam0 22003251 450 SOBE0008077120251120130930.097888459181172011-61620240910d2010 |||||ita|0103 baitaIT<<L'>>arte magicaAndré Bretoncon la collaborazione di Gérard Legrand3. edMilanoAdelphi2010359 p.ill.30 cmTraduzione di Roberto Lucci, Augusto CombaFrontespizio su due pagine<<L'>>art magiqueSOBA000314433041390Breton, André <1896-1966>A600200032523070384498Legrand, GérardSOBA00031444070ITUNISOB20251120RICAUNISOBUNISOB700181640SOBE00080771M 102 Monografia moderna SBNM700000285SI18164020240905acquistoVmenleUNISOBUNISOB20240910100856.020251120130930.0bethbArt magique3041390UNISOB03399nam 22007215 450 991101597010332120250721130933.03-031-94795-910.1007/978-3-031-94795-7(MiAaPQ)EBC32227084(Au-PeEL)EBL32227084(CKB)39694542900041(DE-He213)978-3-031-94795-7(OCoLC)1531323144(EXLCZ)993969454290004120250721d2025 u| 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierElectronic Materials Innovations and Reliability in Advanced Memory Packaging /by Chong Leong Gan, Chen Yu Huang1st ed. 2025.Cham :Springer Nature Switzerland :Imprint: Springer,2025.1 online resource (278 pages)Springer Series in Reliability Engineering,2196-999X3-031-94794-0 Influences of Electronic Materials Properties on Packaging Reliability -- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging -- Materials Development for Future Data Center Applications -- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging -- Hybrid Bonding Device Packaging -- Hardware Reliability for Memory Modules and SSDs -- Innovative Sustainable Electronics Materials in Advanced Memory Packaging -- PCB and Substrate in Future Memory Applications.This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.Springer Series in Reliability Engineering,2196-999XElectronicsMaterialsElectronic circuitsElectronic circuit designMaterialsIndustrial engineeringProduction engineeringElectronic MaterialsElectronic Circuits and SystemsElectronics Design and VerificationMaterials EngineeringIndustrial and Production EngineeringElectronicsMaterials.Electronic circuits.Electronic circuit design.Materials.Industrial engineering.Production engineering.Electronic Materials.Electronic Circuits and Systems.Electronics Design and Verification.Materials Engineering.Industrial and Production Engineering.541.0421621.3815Gan Chong Leong1355814Huang Chen-Yu1834518MiAaPQMiAaPQMiAaPQBOOK9911015970103321Electronic Materials Innovations and Reliability in Advanced Memory Packaging4410011UNINA