00932nam a2200265 i 450099100103362970753620020507105409.0970307s1978 it ||| | ita b10164212-39ule_instLE00641033ExLDip.to Fisicaita001.6621.3.9Lilen, M. Henri462551Introduzione alla microinformatica :dal microelaboratore al microcalcolatore /Henri Lilen2a ed.Milano :Editrice Il Rostro,1978391 p. :ill. ;24 cm.Microelectronics.b1016421221-09-0627-06-02991001033629707536LE006 621.3.9 LIL12006000050913le006-E0.00-l- 00000.i1019975527-06-02Introduzione alla microinformatica188846UNISALENTOle00601-01-97ma -itait 0101797nam 2200529 450 991070655400332120171129131529.0(CKB)5470000002456907(OCoLC)1013466540(EXLCZ)99547000000245690720171129j200104 ua 0engurbn|||||||||txtrdacontentcrdamediacrrdacarrierHigh temperature fatigue crack growth behavior of Alloy 10 /John GaydaCleveland, Ohio :National Aeronautics and Space Administration, Glenn Research Center,April 2001.1 online resource (14 pages) illustrationsNASA/TM ;2001-210814"April 2001.""Performing organization: National Aeronautics and Space Administration, John H. Glenn Research Center at Lewis Field"--Report documentation page.Includes bibliographical references (page 4).Crack propagationnasatEngine designnasatFracture strengthnasatHeat of solutionnasatHigh strength alloysnasatNiobiumnasatTantalumnasatThermal fatiguenasatCrack propagation.Engine design.Fracture strength.Heat of solution.High strength alloys.Niobium.Tantalum.Thermal fatigue.Gayda John1400320NASA Glenn Research Center,GPOGPOBOOK9910706554003321High temperature fatigue crack growth behavior of Alloy 103476733UNINA