10625nam 2200493 450 99649986260331620231110213642.09783031172076(electronic bk.)9783031172069(MiAaPQ)EBC7141553(Au-PeEL)EBL7141553(CKB)25360910800041(OCoLC)1351202970(PPN)266349196(EXLCZ)992536091080004120230330d2022 uy 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierAdvanced materials and components for 5G and beyond /Colin TongCham, Switzerland :Springer,[2022]©20221 online resource (276 pages)Springer Series in Materials Science ;v.327Print version: Tong, Colin Advanced Materials and Components for 5G and Beyond Cham : Springer,c2022 9783031172069 Includes bibliographical references and index.Intro -- Preface -- Contents -- Abbreviations -- About the Author -- Chapter 1: 5G Technology Components and Material Solutions for Hardware System Integration -- 1.1 Evolution of 5G Technology -- 1.2 5G Technology Components -- 1.2.1 5G Spectrum -- 1.2.2 Massive Multiple-Input Multiple-Output (MIMO) Antennas -- 1.2.3 Network Slicing -- 1.2.4 Dual Connectivity and Long Term Evolution (LTE) Coexistence -- 1.2.5 Support for Cloud Implementation and Edge Computing -- 1.3 Materials Solutions for 5G Hardware System Integration -- 1.3.1 Evolution of the Cellular Base Station and Its Construction Materials -- 1.3.2 Drivers to 5G Hardware System Integration -- 1.3.3 Materials and Electronic Components for 5G Packaging Technology -- 1.3.3.1 Packaging Requirements for 5G Systems -- 1.3.3.2 Dielectric Materials for 5G Module Packages -- 1.3.3.3 Microwave Circuit Design and Materials -- 1.3.3.4 Thermal Conductors and Thermal Management for 5G -- 1.3.3.5 Integration of Passive Components -- 1.3.3.5.1 Discrete Lumped Circuits for sub6 GHz 5G Bands -- 1.3.3.5.2 Distributed Components for mm-Wave -- 1.3.3.6 Antenna Systems in Package -- 1.3.3.7 High-Precision Patterning in Heterogeneous Package Integration for 5G -- 1.3.4 Nanomaterials for Nanoantennas in 5G -- 1.4 Challenges in 5G and Beyond - 6G -- 1.5 Outlook and Future Perspectives -- References -- Chapter 2: Semiconductor Solutions for 5G -- 2.1 Evolution of 5G Semiconductor Technologies -- 2.2 Effect of CMOS Technology Scaling on Millimeter Wave Operations -- 2.3 Distributed and Lumped Design Approaches for Fabricating Passives -- 2.3.1 Distributed Approach -- 2.3.2 Lumped approach -- 2.4 Comparison of Silicon and III-V Semiconductors -- 2.5 Transistor Model Design Challenge in CMOS Technology -- 2.6 GaN and GaN-on-SiC Wide Bandgap Semiconductors for 5G Applications.2.6.1 Characteristics of GaN Devices Applied in 5G Technology -- 2.6.2 GaN Power Integration for MMIC in 5G Technology -- 2.6.2.1 GaN Power Integration for MMICS -- 2.6.2.2 GaN Base Station PAs -- 2.6.2.3 GaN Frequency Synthesis -- References -- Chapter 3: Design and Performance Enhancement for 5G Antennas -- 3.1 5G Antenna Classification -- 3.1.1 Classification Based on Input and Output Ports -- 3.1.2 Classification Based on Antenna Types -- 3.2 Performance Enhancement Techniques for 5G Antenna Design -- 3.2.1 General Antenna Performance Enhancement Techniques -- 3.2.2 Mutual Coupling Reduction (Decoupling) Techniques -- 3.3 Structural Design and Building Materials of 5G Antennas -- 3.3.1 SISO Wideband Antennas -- 3.3.1.1 Single Element Antenna -- 3.3.1.2 Multielement Antennas -- 3.3.2 SISO Multiband Antenna -- 3.3.3 MIMO Wideband Antennas -- 3.3.3.1 Multielement Without Metal Rim Antennas -- 3.3.3.1.1 Dual Element Antenna Without Metal Rim -- 3.3.3.1.2 Multielement Antenna Without Metal Rim -- 3.3.3.1.3 Multielement Antenna with Metal Rim -- 3.3.4 MIMO Multiband Antennas -- References -- Chapter 4: PCB Materials and Design Requirements for 5G Systems -- 4.1 The Evolution of Printed Circuit Boards -- 4.1.1 History -- 4.1.2 Materials and Fabrication Process -- 4.2 RF and High Frequency PCB Technologies -- 4.2.1 Basic Circuit Configuration of High-Frequency PCBs -- 4.2.2 Transmission Line Parameters Used in RF/High Frequency PCB Design -- 4.3 Designing High-Frequency PCBs -- 4.3.1 Variables Affecting the Performance of High-Frequency PCBs -- 4.3.2 High-Frequency PCB Layout Techniques -- 4.4 Materials Selection of PCBs for Millimeter Wave Applications -- 4.4.1 High-Frequency PCB Material Selection Guidelines -- 4.4.2 PCB Materials Used for High-Frequency Applications -- 4.4.2.1 PCB Substrate Materials -- 4.4.2.2 Conductors for High-Frequency PCBs.4.5 The Role of Materials in High Frequency PCB Fabrication -- 4.6 Material Issues Related to 5G Applications -- 4.6.1 Mixed Signal Acceptance Circuit Board Designs -- 4.6.2 EMI Shielding Challenges -- 4.6.3 Impedance Control and Signal Loss -- 4.6.4 Thermal Management Challenges -- 4.6.5 Moisture Absorption -- References -- Chapter 5: Materials for High Frequency Filters -- 5.1 The 5G Effect on Filter Technologies -- 5.1.1 Current Status of Mobile Device Filter Technologies -- 5.1.2 The 5G Filter Performance Challenges -- 5.1.2.1 The 5G Frequency Spectrum -- 5.1.2.2 The 5G Filter Requirements -- 5.1.2.3 Physical Design and Emerging Solutions for the 5G Filters -- 5.2 Materials and Design for Acoustic Filters -- 5.2.1 Current Application and Band Allocation of Acoustic Filter Technology -- 5.2.2 Basic Working Principle of the BAW Filter -- 5.2.2.1 Structure of the BAW Resonator -- 5.2.2.2 Key Parameters of the BAW Resonator -- 5.2.2.3 Topology of the BAW Filter -- 5.2.3 Materials for the BAW Resonator -- 5.2.3.1 Piezoelectric Materials -- 5.2.3.2 Electrode Materials -- 5.2.4 Temperature Compensation -- 5.2.5 Frequency Tenability -- 5.2.6 Lithium Niobate and Laterally Excited Bulk-Wave Resonators (XBAR) -- 5.3 Microwave and Millimeter Wave Filters Based on MEMS Technology -- 5.3.1 Micromachined Filters -- 5.3.1.1 Surface Micromachining Superconductor Filters -- 5.3.1.2 Planar Microstrip Filters -- 5.3.1.3 Coplanar Waveguide Filters -- 5.3.1.4 Micromachined Dielectric Waveguide Resonate Filters -- 5.3.2 Micromachined Tunable Filters -- 5.4 Metamaterial and Metasurface Filters for 5G Communications -- References -- Chapter 6: EMI Shielding Materials and Absorbers for 5G Communications -- 6.1 EMI Shielding Design Principle in 5G Systems -- 6.2 Component Package-Level EMI Shielding for 5G Modules -- 6.3 Board Level EMI Shielding for 5G Systems.6.4 Design and Materials Selection for 5G Absorbers -- 6.5 Advanced Metallic Composite Materials for High-Frequency EMI Shielding -- 6.5.1 Hollow and Porous Metal-Based EMI Shielding Materials -- 6.5.2 Metal-Based EMI Shielding Composites with Frequency-Selective Transmission -- 6.5.3 Particle-Based EMI Shielding Metallic Composites -- 6.5.4 MXene-Based EMI Shielding Composites -- 6.5.5 Metal-Based Flexible EMI Shielding Materials -- 6.6 Emerging Polymer-Based EMI Shielding and Absorber Materials -- References -- Chapter 7: Thermal Management Materials and Components for 5G Devices -- 7.1 Thermal Management Challenges and Strategies in 5G Devices -- 7.1.1 Form Factor-Constrained Thermal Management Solutions -- 7.1.2 5G Mobile Device Level Thermal Management -- 7.1.3 Base Station Level Thermal Management -- 7.1.4 Emerging Thermal Management Challenges and Strategies -- 7.2 Thermal Management Materials and Components for 5G-Enabled Mobile Devices -- 7.2.1 Thermal Management Design and Fundamental Solutions for Smartphones -- 7.2.1.1 Thermal Management Design Guideline -- 7.2.1.2 Fundamental Thermal Management Solutions -- 7.2.1.2.1 Heat Conduction and Spreading -- 7.2.1.2.2 Convective Air Cooling -- 7.2.1.2.3 Convective Liquid Cooling -- 7.2.2 Material Selection for Heat Spreaders and Heat Sinks -- 7.2.3 Flat Plate Heat Pipes and Vapor Chambers for Mobile Electronic Devices -- 7.2.4 Thermal Interface Materials -- 7.2.5 Thermal Insulation Materials -- 7.2.6 Thermal Metamaterials -- 7.3 Thermal Management of 5G Base Station Antenna Arrays -- 7.3.1 Cooling in Traditional AESA's -- 7.3.2 Cooling in Planar AESA's -- 7.3.3 Antenna Array Cooling at Millimeter Waves -- 7.4 Thermal Management of 5G Edge Computing -- References -- Chapter 8: Protective Packaging and Sealing Materials for 5G Mobile Devices.8.1 Design of 5G Millimeter Wave Compatible Covers for High-End Mobile Devices -- 8.1.1 Dielectric Cover Design -- 8.1.2 Metallic Cover Design with Inserted Dielectric Slots -- 8.1.3 Integration Design Consideration -- 8.2 Thin Film Encapsulation in 5G Electronic Packaging -- 8.3 Adhesives and Sealants for 5G Systems -- References -- Chapter 9: Perspectives on 5G and Beyond Applications and Related Technologies -- 9.1 Applications in Industry Verticals and Their Needs -- 9.1.1 5G in Automotive -- 9.1.2 Big Data Analytics in 5G -- 9.1.3 5G Emergency Communications -- 9.1.4 Future Factories Enabled by 5G Technology -- 9.1.5 Smart Health-Care Network Based on 5G -- 9.1.6 5G Technology for Smart Energy Management and Smart Cities -- 9.1.6.1 5G Technology for Smart Cities -- 9.1.6.2 Applications of 5G Technology in the Construction Industry and Infrastructures -- 9.1.6.3 Smart Building System Integrated with 5G Communication Technology -- 9.2 Perspectives on 6G Wireless Communications -- 9.3 Challenges and Prospects of Core Materials and Components for 5G and Beyond -- 9.3.1 Ultralow-Loss High-Reliability Copper-Clad Laminates -- 9.3.2 5G Metamaterials and Low-Loss High-Performance RF Technology -- 9.3.3 5G Low-Loss Magnetoelectric Functional Materials and Devices -- 9.3.4 Multimodule Integrated Printed Circuit Boards -- 9.3.5 Manufacturing Technology of Photoelectric Integrated Cables -- 9.3.6 Photonics-Assisted Ultrabroadband RF Transceiver Integrated Modules -- 9.3.7 All-Optical Network and Superlarge-Core Fiber Optic Cables -- References -- Index.Springer Series in Materials Science PhysicsPhysics.405Tong Xingcun Colin1063324MiAaPQMiAaPQMiAaPQ996499862603316Advanced materials and components for 5G and beyond3083054UNISA06115nam 22006135 450 991079298620332120230918202645.01-4798-2630-810.18574/9781479826308(CKB)3710000001304952(MiAaPQ)EBC4714296(StDuBDS)EDZ0001804042(OCoLC)1007994277(MdBmJHUP)muse65733(DE-B1597)547634(DE-B1597)9781479826308(EXLCZ)99371000000130495220200608h20172017 fg 0engurcnu||||||||rdacontentrdamediardacarrierChina, The United States, and the Future of Southeast Asia U.S.-China Relations, Volume II /New York, NY :New York University Press,20171 online resource (375 pages)U.S.-China Relations ;2Issued as part of book collections on Project MUSE.Includes bibliographical references at the end of each chapters and index.Front matter --Contents --Preface --Introduction --1. Southeast Asia: thriving in the shadow of giants --2. Asean’s external policy: caught between the united states and china --3. Nontraditional security threats in Asean and beyond --4. Pragmatic equidistance: how Indonesia manages its great power relations --5. Economic and strategic trends in southeast Asia: the view from Singapore --6. Tightrope walking over the sea of trouble: Vietnam’s foreign policy, maritime strategy, and relations with china and the united states --7. Not between Scylla and Charybdis: Malaysia’s relations with china and the united states --8. The mainland minus one: power dynamics in Thailand, Laos, Cambodia, and Myanmar --9. Japan’s relationship with southeast Asia: the perpetual potential partner --10. India and southeast Asia: from looking to acting east policy --11. China’s economic approach to asea --12. China and the united states in southeast Asia --13. U.s. security strategy and southeast Asia --14. U.s. policy options in the south china sea --Conclusion --About the contributors --IndexDistinguished experts explain the economic trends and varied political goals at work in Southeast Asia. With China’s emergence as a powerful entity in Southeast Asia, the region has become an unlikely site of conflict between two of the world’s great powers. The United States, historically regarded as the protector of Pacific Southeast Asia—consisting of nations such as Vietnam, the Philippines, Myanmar, and Malaysia—is now called upon to respond to what many would consider bullying on the part of the Chinese. These and other countries have become the economic and political engine of China. While certainly inclined to help the country’s former allies, the United States has grown undeniably closer to China in the recent decades of global interconnected economic growth. China, the United States, and the Future of Southeast Asia uncovers and delves into the complicated dynamics of this situation. Covering topics such as the controversial response to human rights violations, the effects of global economic interconnectedness, and contested sovereignty over resource-rich islands, this volume provides a modern and nuanced perspective on the state of the region. For anyone interested in understanding the evolving global balance of power, China, the United States, and the Future of Southeast Asia illuminates how countries as different as Thailand and Indonesia see the growing competition between Beijing and Washington. Distinguished experts explain the economic trends and varied political goals at work in Southeast Asia. With China’s emergence as a powerful entity in Southeast Asia, the region has become an unlikely site of conflict between two of the world’s great powers. The United States, historically regarded as the protector of Pacific Southeast Asia—consisting of nations such as Vietnam, the Philippines, Myanmar, and Malaysia—is now called upon to respond to what many would consider bullying on the part of the Chinese. These and other countries have become the economic and political engine of China. While certainly inclined to help the country’s former allies, the United States has grown undeniably closer to China in the recent decades of global interconnected economic growth. China, the United States, and the Future of Southeast Asia uncovers and delves into the complicated dynamics of this situation. Covering topics such as the controversial response to human rights violations, the effects of global economic interconnectedness, and contested sovereignty over resource-rich islands, this volume provides a modern and nuanced perspective on the state of the region. For anyone interested in understanding the evolving global balance of power, China, the United States, and the Future of Southeast Asia illuminates how countries as different as Thailand and Indonesia see the growing competition between Beijing and Washington.U.S.-China relations ;v. 2POLITICAL SCIENCE / International Relations / GeneralbisacshFBCInternationale relationerFBCKinaPolitisk videnskabFBCUnited StatesForeign relationsChinaChinaForeign relationsUnited StatesAsia, CentralForeign relationsSoutheast AsiaForeign relationsLatin AmericaForeign relationsPOLITICAL SCIENCE / International Relations / General.Internationale relationerKinaPolitisk videnskab327.73051z951Denoon Davidedthttp://id.loc.gov/vocabulary/relators/edtDE-B1597DE-B1597BOOK9910792986203321China, The United States, and the Future of Southeast Asia3726024UNINA