01876oam 2200397z- 450 99628113900331620080925085128.01-5090-8992-6(CKB)1000000000331791(EXLCZ)99100000000033179120220614c2007uuuu -u- -engPolytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Odaiba, Tokyo, Japan, January 15-18, 2007 s /IEEE Components, Packaging and Manufacturing Technology SocietyIEEE1-4244-1130-0 1-4244-1186-6 Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and PhotonicsElectronics Communications and Computers POLMYERS & ADHESIVES IN MICROELECTRONICS & PHOTONICS, POLYTRONIC 2007 - 6TH INTERNATIONAL CONFERENCE ONPOLMYERS AND ADHESIVES IN MICROELECTRONICS & PHOTONICS, POLYTRONIC 2007 - 6TH INTERNATIONAL CONFERENCE ONPOLYMERS & ADHESIVES IN MICROELECTRONICS AND PHOTONICS, 2007. POLYTRONIC 2007. 6TH INTERNATIONAL CONFERENCE ONMicroelectronic packagingMaterialsCongressesPolymersCongressesIntegrated circuitsReliabilityCongressesPhotonicsMaterialsCongressesPolymeric compositesCongressesMicroelectronic packagingMaterialsPolymersIntegrated circuitsReliabilityPhotonicsMaterialsPolymeric compositesInstitute of Electrical and Electronics Engineers.PROCEEDING996281139003316Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics2871620UNISA