01763oam 2200337z- 450 99628110920331620080927084110.01-5090-8960-8(CKB)1000000000331517(EXLCZ)99100000000033151720220614c2007uuuu -u- -engProceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE 2007 /edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMTIEEE1-4244-1105-X 1-4244-1106-8 VLSI Design 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007THERMAL, MECHANICAL & MULTI-PHYSICS SIMULATION EXPERIMENTS IN MICROELECTRONICS & MICRO-SYSTEMS, 2007. EUROSIME 2007. INTERNATIONAL CONFERENCE ONTHERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION EXPERIMENTS IN MICROELECTRONICS & MICRO-SYSTEMS, 2007. EUROSIME 2007. INTERNATIONAL CONFERENCE ONMicroelectronicsSimulation methodsCongressesSystems engineeringSimulation methodsCongressesMicroelectronicsSimulation methodsSystems engineeringSimulation methods621.38101/1Ernst L. J1063494Components, Packaging & Manufacturing Technology Society.PROCEEDING996281109203316Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems2872543UNISA