01339nam 2200397 450 99628090000331620230803212949.02-35500-027-1(CKB)3710000000373887(WaSeSS)IndRDA00094623(WaSeSS)IndRDA00119975(EXLCZ)99371000000037388720200310d2014 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 1-4 April 2014 : Cannes, France /IEEEPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2014.1 online resource (376 pages)Includes index.1-4799-3221-3 2-35500-028-X Optoelectronic devicesCongressesMicroelectronic packagingCongressesOptoelectronic devicesMicroelectronic packaging621.381045Institute of Electrical and Electronics Engineers,WaSeSSWaSeSSPROCEEDING9962809000033162014 Symposium on Design, Test, Integration and Packaging of MEMS2516555UNISA