01264nam 2200361 450 99628036370331620230814225842.01-5386-4933-0(CKB)4100000007125731(WaSeSS)IndRDA00121295(EXLCZ)99410000000712573120200327d2018 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2018 13th International Congress Molded Interconnect Devices September 25-26 2018, Würzburg, Germany /IEEE Electronics Packaging SocietyPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2018.1 online resource (29 pages)1-5386-4934-9 Molded interconnect devicesCongressesThree-dimensional display systemsCongressesMolded interconnect devicesThree-dimensional display systems621.381044IEEE Electronics Packaging Society,WaSeSSWaSeSSPROCEEDING9962803637033162018 13th International Congress Molded Interconnect Devices2507218UNISA