01395nam 2200385 450 99627961160331620230814223709.01-5386-7099-2(CKB)4100000005480523(WaSeSS)IndRDA00122074(EXLCZ)99410000000548052320200421d2018 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2018 IEEE Computer Society Annual Symposium on VLSI 8-11 July 2018, Hong Kong, China /IEEE Computer SocietyPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2018.1 online resource (87 pages)1-5386-7100-X System designCongressesComputersCircuitsDesign and constructionCongressesIntegrated circuitsVery large scale integrationDesign and constructionCongressesSystem designComputersCircuitsDesign and constructionIntegrated circuitsVery large scale integrationDesign and construction004.21IEEE Computer Society,WaSeSSWaSeSSPROCEEDING9962796116033162018 IEEE Computer Society Annual Symposium on VLSI2532773UNISA01507oam 2200433Ka 450 991069889850332120090504085230.0(CKB)5470000002396876(OCoLC)320074814(EXLCZ)99547000000239687620090504d1987 ua 0engtxtrdacontentcrdamediacrrdacarrierAnalysis and test of superplastically formed titanium hat-stiffened panels under compression[electronic resource] /Randall C. Davis, Dick M. Royster, and Thomas T. BalesHampton, Va. :National Aeronautics and Space Administration, Langley Research Center,[1987]1 volumeNASA technical memorandum ;88989Title from title screen (viewed May 1, 2009)Forming techniquesnasatPlastic propertiesnasatSuperplasticitynasatTitaniumnasatForming techniques.Plastic properties.Superplasticity.Titanium.Davis Randall C1399410Royster Dick M1399411Bales Thomas T1399412Langley Research Center.GPOGPOGPOBOOK9910698898503321Analysis and test of superplastically formed titanium hat-stiffened panels under compression3464580UNINA