01414nam 2200373 450 99627948280331620230417131701.04-904090-17-9(CKB)3710000000720741(NjHacI)993710000000720741(EXLCZ)99371000000072074120230417d2016 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2016 International Conference on Electronics Packaging (ICEP) 20-22 April 2016, Hokkaido, Japan /Institute of Electrical and Electronics EngineersPiscataway, New Jersey :IEEE,[2016]©20161 online resource (692 pages) illustrations1-5090-1927-8 4-904090-16-0 ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications.2016 International Conference on Electronics Packaging Electronic packagingCongressesElectronic packaging621.381046NjHacINjHaclPROCEEDING9962794828033162016 International Conference on Electronics Packaging (ICEP)2500148UNISA