01479nam 2200385 450 99627944720331620230420013128.01-4673-9385-11-4673-9386-X(CKB)3780000000082206(NjHacI)993780000000082206(EXLCZ)99378000000008220620230420d2015 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2015 International 3D Systems Integration Conference (3DIC 2015) Sendai, Japan, 31 August - 2 September 2015 /Institute of Electrical and Electronics EngineersPiscataway, NJ :IEEE,[2015]©20151 online resource (353 pages) illustrationsIncludes index.Annotation The IEEE 3DIC 2015 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications.2015 International 3D Systems Integration Conference 3D Systems Integration Conference Three-dimensional integrated circuitsCongressesThree-dimensional integrated circuits621NjHacINjHaclPROCEEDING9962794472033162015 International 3D Systems Integration Conference (3DIC 2015)3088716UNISA00977nam a2200253 i 4500991003325719707536111223s2011 it 00 ita d9788883501692b14316286-39ule_instBibl. Dip.le Aggr. Scienze Economia - Sez. Settore Economicoita330.1092Luigi Einaudi /a cura di G. Manca, M. A. RomaniMilano :Università Bocconi Editore,2011xii, 291 p., [14] p. di tavole, [1] carta di tavola ripiegata :ill. ;24 cmI maestri della BocconiEinaudi, LuigiManca, GavinoRomani, Achille Marzio.b1431628607-02-1707-02-17991003325719707536LE025 ECO 330.1 MAN03.0112025000277472le025gE20.00-l- 00000.i1579602407-02-17Luigi Einaudi245623UNISALENTOle02507-02-17ma itait 00