01479nam 2200385 450 99627944720331620230420013128.01-4673-9385-11-4673-9386-X(CKB)3780000000082206(NjHacI)993780000000082206(EXLCZ)99378000000008220620230420d2015 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2015 International 3D Systems Integration Conference (3DIC 2015) Sendai, Japan, 31 August - 2 September 2015 /Institute of Electrical and Electronics EngineersPiscataway, NJ :IEEE,[2015]©20151 online resource (353 pages) illustrationsIncludes index.Annotation The IEEE 3DIC 2015 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications.2015 International 3D Systems Integration Conference 3D Systems Integration Conference Three-dimensional integrated circuitsCongressesThree-dimensional integrated circuits621NjHacINjHaclPROCEEDING9962794472033162015 International 3D Systems Integration Conference (3DIC 2015)3088716UNISA