01537nam 2200349 450 99627937980331620230419082112.01-5090-3443-9(CKB)3710000000997356(NjHacI)993710000000997356(EXLCZ)99371000000099735620230419d2016 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference /Institute of Electrical and Electronics EngineersPiscataway :IEEE,2016.1 online resource1-5090-3444-7 Annotation It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field.2016 IEEE 37th International Electronics Manufacturing Technology Electronic industriesCongressesElectronic industries621.381NjHacINjHaclPROCEEDING9962793798033162016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference2514469UNISA