01575ngm 2200409 450 99621595790331620211109143443.01-5090-8952-7(CKB)1000000000695797(IEEE)EDP079(EXLCZ)99100000000069579720201113d2008 uy vengur|||||||||||tdirdacontentrdacontentcrdamediavrdamediardacarrierInterconnect technology for 32 NM and beyond /Jeff Gambino[United States] :IEEE,2008.1 online resource (1 video file, 60 mins) color illustrations1-4244-1446-6 1-4244-1447-4 This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.DielectricsElectroplatingDielectrics.Electroplating.537.24Gambino Jeff845395IEEEIEEEPROCEEDING996215957903316Interconnect technology for 32 NM and beyond1886779UNISA