01665nam 2200397 450 99621396570331620230721004822.01-5090-8060-01-4244-3624-9(CKB)1000000000710048(WaSeSS)IndRDA00093384(WaSeSS)IndRDA00119576(EXLCZ)99100000000071004820200304d2008 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei /compiled by Institute of Electrical and Electronics EngineersPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2008.1 online resource (423 pages)1-4244-3622-2 1-4244-3623-0 Microelectronic packagingCongressesMicroelectromechanical systemsCongressesMicroelectronic packagingMicroelectromechanical systems621.381046Institute of Electrical and Electronics Engineers,WaSeSSWaSeSSPROCEEDING9962139657033162008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP)2546557UNISA