01452oam 2200445zu 450 99621359490331620210807004552.01-4673-0742-4(CKB)3420000000000466(SSID)ssj0000751776(PQKBManifestationID)12239168(PQKBTitleCode)TC0000751776(PQKBWorkID)10752633(PQKB)11245157(NjHacI)993420000000000466(EXLCZ)99342000000000046620160829d2012 uy engur|||||||||||txtccr2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration[Place of publication not identified]IEEE20121 online resource (262 pages) illustrationsBibliographic Level Mode of Issuance: Monograph1-4673-0743-2 PhotonicsMaterialsCongressesThree-dimensional integrated circuitsSealing (Technology)CongressesPhotonicsMaterialsThree-dimensional integrated circuits.Sealing (Technology)621.36IEEE StaffPQKBPROCEEDING9962135949033162012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration2509919UNISA