01733oam 2200445zu 450 99621259190331620210807003346.0(CKB)111026746722802(SSID)ssj0000393597(PQKBManifestationID)12151857(PQKBTitleCode)TC0000393597(PQKBWorkID)10372090(PQKB)10109657(EXLCZ)9911102674672280220160829d1998 uy engtxtccrProceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 15-18, 1998[Place of publication not identified]IMAPS1998Bibliographic Level Mode of Issuance: Monograph0-7803-4795-1 Electronic packagingMaterialsCongressesElectrical EngineeringHILCCElectrical & Computer EngineeringHILCCEngineering & Applied SciencesHILCCElectronic packagingMaterialsCongressesElectrical EngineeringElectrical & Computer EngineeringEngineering & Applied Sciences621.381/046Wong C. PInternational Microelectronics and Packaging SocietyInternational Symposium on Advanced Packaging MaterialsPQKBPROCEEDING996212591903316Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 15-18, 19982501351UNISA