01815nam 2200469 450 99621238760331620230721023426.01-4244-4161-7(CKB)2400000000003079(SSID)ssj0000453093(PQKBManifestationID)12192309(PQKBTitleCode)TC0000453093(PQKBWorkID)10472729(PQKB)10532519(WaSeSS)IndRDA00123503(EXLCZ)99240000000000307920200522d2009 uy 0engur|||||||||||txtccr10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 26-29 April 2009, Delft, Netherlands /Institute of Electrical and Electronics EngineersPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2009.1 online resource (114 pages)Bibliographic Level Mode of Issuance: Monograph1-4244-4159-5 1-4244-4160-9 Integrated circuitsSimulation methodsCongressesMicroelectronicsDesignCongressesMicroelectronicsSimulation methodsCongressesIntegrated circuitsSimulation methodsMicroelectronicsDesignMicroelectronicsSimulation methods621.3815Institute of Electrical and Electronics Engineers,WaSeSSWaSeSSPROCEEDING99621238760331610th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2534354UNISA