01477oam 2200409zu 450 99620770030331620210806235938.01-5090-9955-7(CKB)1000000000278318(SSID)ssj0000394654(PQKBManifestationID)12122699(PQKBTitleCode)TC0000394654(PQKBWorkID)10425851(PQKB)10809998(NjHacI)991000000000278318(EXLCZ)99100000000027831820160829d2005 uy engur|||||||||||txtccrEMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan : [proceedings[Place of publication not identified]IEEE20051 online resource (vi, 301 pages)Bibliographic Level Mode of Issuance: Monograph1-4244-0107-0 Electronic packagingCongressesElectronic packagingMaterialsCongressesElectronic packagingElectronic packagingMaterials621.381046PQKBPROCEEDING996207700303316EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan :2545441UNISA