02021oam 2200529zu 450 99620449590331620210806235952.0(CKB)1000000000022462(SSID)ssj0000395916(PQKBManifestationID)12121613(PQKBTitleCode)TC0000395916(PQKBWorkID)10459119(PQKB)11527960(EXLCZ)99100000000002246220160829d2004 uy engtxtccr2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR[Place of publication not identified]IEEE2004Bibliographic Level Mode of Issuance: Monograph0-7803-8744-9 Microelectronic packagingMaterialsCongressesPolymersReliabilityCongressesIntegrated circuitsMaterialsCongressesPhotonicsCongressesPolymeric compositesCongressesElectrical & Computer EngineeringHILCCEngineering & Applied SciencesHILCCElectrical EngineeringHILCCMicroelectronic packagingMaterialsPolymersReliabilityIntegrated circuitsMaterialsPhotonicsPolymeric compositesElectrical & Computer EngineeringEngineering & Applied SciencesElectrical Engineering621.381/046Institute of Electrical and Electronics EngineersInternational IEEE Conference on Polymers and Adhesives in Microelectronics and PhotonicsPQKBPROCEEDING9962044959033162004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 12-15, September, 2004, Portland, OR2540907UNISA