01276oam 2200361zu 450 99620406660331620210806235836.01-5090-9928-X(CKB)1000000000022613(SSID)ssj0000454405(PQKBManifestationID)12150174(PQKBTitleCode)TC0000454405(PQKBWorkID)10398050(PQKB)11579061(EXLCZ)99100000000002261320160829d2005 uy engtxtccr2005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems[Place of publication not identified]I E E E2005Bibliographic Level Mode of Issuance: Monograph0-7803-9062-8 621.38101/1Ernst L. J1063494Ernst L. J1063494Components, Packaging & Manufacturing Technology Society StaffPQKBPROCEEDING9962040666033162005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems2532768UNISA