01915oam 2200505zu 450 99620248360331620210806235945.0(CKB)1000000000022064(SSID)ssj0000395880(PQKBManifestationID)12129102(PQKBTitleCode)TC0000395880(PQKBWorkID)10459117(PQKB)10403087(EXLCZ)99100000000002206420160829d2003 uy engtxtccrProceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits : IPFA 2003 : [scheduled, 7 to 11 July, 2003, Singapore[Place of publication not identified]IEEE2003Bibliographic Level Mode of Issuance: Monograph0-7803-7722-2 Integrated circuitsDefectsCongressesIntegrated circuitsTestingCongressesElectrical & Computer EngineeringHILCCEngineering & Applied SciencesHILCCElectrical EngineeringHILCCIntegrated circuitsDefectsIntegrated circuitsTestingElectrical & Computer EngineeringEngineering & Applied SciencesElectrical Engineering621.3815Ho PhilipIEEE Reliability SocietyNational University of SingaporeIEEE Electron Devices SocietyIEEE Reliability/CPMT/ED Singapore ChapterInternational Symposium on the Physical & Failure Analysis of Integrated CircuitsPQKBPROCEEDING996202483603316Proceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits : IPFA 2003 :2540908UNISA