01785nam 2200457 450 99620215980331620230617014930.0(CKB)1000000000022394(SSID)ssj0000395057(PQKBManifestationID)12081914(PQKBTitleCode)TC0000395057(PQKBWorkID)10450259(PQKB)11204090(WaSeSS)IndRDA00124104(EXLCZ)99100000000002239420200604d2004 uy 0engur|||||||||||txtccrHDP '04 proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis : June 30-July 3, 2004, Bao Long Hotel, Shanghai, China /organized by Institute of Electrical and Electronics Engineers [and fifteen others]Piscataway, New Jersey :Institute of Electrical and Electronics Engineers,2004.1 online resource (395 pages)Bibliographic Level Mode of Issuance: Monograph0-7803-8620-5 Integrated circuitsDesign and constructionCongressesElectronic packagingCongressesMicroelectromechanical systemsCongressesIntegrated circuitsDesign and constructionElectronic packagingMicroelectromechanical systems621.3815Institute of Electrical and Electronics Engineers,IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure AnalysisWaSeSSWaSeSSPROCEEDING996202159803316HDP '042525656UNISA