01835oam 2200493zu 450 99619963800331620210807003521.0(CKB)111026746723968(SSID)ssj0000394707(PQKBManifestationID)12171884(PQKBTitleCode)TC0000394707(PQKBWorkID)10404668(PQKB)10353500(EXLCZ)9911102674672396820160829d1998 uy engtxtccr1998 2nd IEMT/IMC Symposium : April 15-17, 1998, Sonic City-Omiya, Tokyo, Japan[Place of publication not identified]IEEE1998Bibliographic Level Mode of Issuance: Monograph0-7803-5090-1 Microelectronic packagingCongressesJapanElectronic apparatus and appliancesCongressesDesign and constructionMicroelectronics industryTechnological innovationsCongressesElectrical & Computer EngineeringHILCCElectrical EngineeringHILCCEngineering & Applied SciencesHILCCMicroelectronic packagingCongressesElectronic apparatus and appliancesCongressesDesign and constructionMicroelectronics industryTechnological innovationsCongressesElectrical & Computer EngineeringElectrical EngineeringEngineering & Applied Sciences621.381/046Components, Packaging & Manufacturing Technology SocietyInternational Microelectronics and Packaging SocietyIEMT/IMC SymposiumPQKBPROCEEDING9961996380033161998 2nd IEMT2498123UNISA