00981nam0-22003731i-450-99000652739040332120070724162221.0000652739FED01000652739(Aleph)000652739FED0100065273920010426d1967----km-y0itay50------baitaITy-------001yySocietà e potereRichard C. SchermerhornRomaArmando1967102 p.21 cmProblemi di sociologia132001Society and power59174306302Schermerhorn,Richard AlonzoITUNINARICAUNIMARCBK99000652739040332113120 SCH043036SESXI N 549 (13)26853*FGBCCOLLEZ. 1047 (13)1417FSPBCFGBCFSPBCSESSociety and power59174UNINA05044nam 2200613 450 99619939130331620230421044547.01-281-84263-X97866118426353-527-61481-83-527-61480-X(CKB)1000000000377544(EBL)482089(OCoLC)609728788(SSID)ssj0000134232(PQKBManifestationID)11162600(PQKBTitleCode)TC0000134232(PQKBWorkID)10055548(PQKB)11687136(MiAaPQ)EBC482089(EXLCZ)99100000000037754420160819h19961996 uy 0engur|n|---|||||txtccrCVD of nonmetals /edited by William S. Rees, JrWeinheim, [Germany] :VCH,1996.©19961 online resource (449 p.)Description based upon print version of record.3-527-29295-0 CVD of Nonmetals; Contents; 1 . Introduction; 1.1 Organization of the Book; 1.1.1 Scope of the Book; 1.1.2 Potential Audience; 1.1.3 Selection of Chapter Topics; 1.1.4 Chapter Organization; 1.1.4.1 Cross-References Between Chapters; 1.1.4.2 Where to Find a Topic; 1.2 Uses of Materials; 1.2.1 Electronic Applications; 1.2.1.1 Band Gap Classifications; 1.2.2 Optical Applications; 1.2.3 Structural Applications; 1.3 Comparison of Deposition Techniques; 1.3.1 Comparison of Chemical Vapor Deposition Sub-Techniques; 1.3.1.1 Organometallic Vapor Phase Epitaxy (OMVPE); 1.3.1.2 PlasmaCVD1.3.1.3 PhotoCVD1.3.1.4 Pressure Modifications in CVD; 1.3.1.5 Spray Pyrolysis Modifications; 1.3.2 Comparison of Non-Chemical Vapor Deposition Technologies; 1.3.2.1 Molecular Beam Epitaxy (MBE); 1.3.2.2 Other Physical Vapor Deposition Techniques; 1.4 General Comments on CVD; 1.4.1 Reactor Types; 1.4.2 Important Reaction Locations in CVD Reactors; 1.5 Experimental Design; 1.5.1 System Configuration; 1.5.1.1 System Reactant Input; 1.5.1.2 Reaction Zones; 1.5.1.3 Reaction Co-Product Removal System; 1.5.2 Handling of Precursors; 1.5.3 Methods of Energy Input; 1.5.3.1 Thermal CVD1.5.3.2 Alternate Modes1.5.4 Vapor Analysis in CVD; 1.6 Reaction Kinetics in CVD; 1.6.1 General Comments; 1.6.2 Vapor Phase Reactions; 1.6.3 Vapor-Solid Phase Reactions; 1.6.4 Solid Phase Reactions; 1.6.5 Control of Reaction Location; 1.6.6 Rate-Determining Steps in CVD; 1.6.7 Temperature and Growth Rate Effects; 1.7 Thermodynamics in CVD; 1.8 General Comments on Precursors; 1.8.1 Design Considerations; 1.8.2 Structural Motifs; 1.8.3 Mechanistic Insights; 1.9 References; 2 . Superconducting Materials; 2.1 Introduction; 2.2 Overview of Superconductivity2.2.1 Physical Properties of Superconductors2.2.2 Low Temperature Superconducting Materials; 2.2.2.1 Crystal Structures of LTS Materials; 2.2.3 High Temperature Superconducting Materials; 2.2.3.1 Crystal Structure of HTS Materials; 2.2.4 Applications of Superconductors; 2.2.4.1 Large-Scale Applications of Superconducting Magnets; 2.2.4.2 Low-Field Applications of Superconductors; 2.2.4.3 Superconducting Electronics Applications; 2.3 CVD of LTS Materials; 2.3.1 Nb3Sn CVD Film Growth; 2.3.1.1 Nb3Sn CVD Precursors and Reaction Schemes; 2.3.1.2 Nb3Sn CVD Reactor Design2.3.1.3 Substrates for Nb3Sn CVD2.3.1.4 Physical Properties of CVD-Derived Nb3Sn Films; 2.3.2 Nb3Ge CVD Film Growth; 2.3.2.1 Nb3Ge CVD Precursors and Reaction Schemes; 2.3.2.2 Nb3Ge CVD Reactor Design; 2.3.2.3 Physical Properties of CVD-Derived Nb3Ge Films; 2.3.2.4 Films Effects of Chemical Doping Upon Physical Properties of CVD-Derived Nb3Ge; 2.3.3 NbC1-y Ny CVD Film Growth; 2.3.3.1 NbC1-yNy CVD Precursors and Reaction Schemes; 2.3.3.2 Reactor Design for CVD of NbC1-y Ny on Carbon Fiber; 2.3.3.3 Physical Properties of CVD-Derived NbCI, Ny Films; 2.3.4 NbN CVD Film Growth2.3.4.1 NbN CVD Precursors and Reaction SchemesWritten by leading experts in the field, this practical reference handbook offers an up-to-date, critical survey of the chemical vapor deposition (CVD) of nonmetals, a key technology in semiconductor electronics, finishing, and corrosion protection.The basics necessary for any CVD process are discussed in the introduction. In the following chapters, precursor requirements, with an emphasis on materials chemistry, common structures of reactants and substrates, as well as reaction control are discussed for a broad range of compositions including superconducting, conducting, semiconductinChemical vapor depositionNonmetalsChemical vapor deposition.Nonmetals.620.44671.735Rees William S.MiAaPQMiAaPQMiAaPQBOOK996199391303316CVD of nonmetals3065981UNISA01324oam 2200433Kn 450 991069169460332120030415160903.0(CKB)5470000002346433(OCoLC)49058156ocm49058156(OCoLC)995470000002346433(EXLCZ)99547000000234643320020214d2002 ua 0engtxtrdacontentcrdamediacrrdacarrierThe lowdown on chain letters[electronic resource][Washington, D.C.] :Federal Trade Commission, Bureau of Consumer Protection, Office of Consumer and Business Education,[2002]FTC consumer alertTitle from title screen (viewed on Apr. 15, 2003).Electronic mail messagesInternet fraudElectronic mail messages.Internet fraud.004.692070.5797011.53381.34364.163United States.Federal Trade Commission.Office of Consumer and Business Education.N@FN@FOCLCQGPOBOOK9910691694603321The lowdown on chain letters3424155UNINA