01285nam0M2200421--I450-99000240282020331620090611113409.088-503-2304-2000240282USA01000240282(ALEPH)000240282USA0100024028220050224d2005----||itac50 baitaITPHP 5guida completaAndi Gutmans, Stig Saether Bakken, Derick RethansMilanoApogeo2005XXIX, 543 p.24 cmGuida completa0012001Guida completaPHP <Linguaggio di programmazione>BNCF005.2762 GUTGUTMANS,Andi447887BAKKEN,Stig Saether572373RETHANS,Derick447889ITICCU20070826990002402820203316005.2762 GUT20735 Ing.005.276200131894BKTECPAOLA9020050224USA011023PAOLA9020050224USA011024PATRY9020080611USA011437PATRY9020080612USA011009PATRY9020080703USA011408PATRY9020090611USA011134PHP 51065502UNISA03591nam 22006855 450 991029984150332120250609110059.03-642-25376-810.1007/978-3-642-25376-8(CKB)3710000000394744(EBL)2093165(SSID)ssj0001501249(PQKBManifestationID)11920998(PQKBTitleCode)TC0001501249(PQKBWorkID)11522614(PQKB)11322646(DE-He213)978-3-642-25376-8(MiAaPQ)EBC2093165(PPN)185483224(MiAaPQ)EBC3109711(EXLCZ)99371000000039474420150411d2015 u| 0engur|n|---|||||txtccrPhotonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules /by Ulrich H. P. Fischer-Hirchert1st ed. 2015.Berlin, Heidelberg :Springer Berlin Heidelberg :Imprint: Springer,2015.1 online resource (336 p.)Description based upon print version of record.3-642-25375-X Includes bibliographical references at the end of each chapters and index.Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index.This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.Springer engineering ebooks.MicrowavesOptical engineeringNanotechnologyElectronic circuitsMicrowaves, RF and Optical Engineeringhttps://scigraph.springernature.com/ontologies/product-market-codes/T24019Nanotechnology and Microengineeringhttps://scigraph.springernature.com/ontologies/product-market-codes/T18000Circuits and Systemshttps://scigraph.springernature.com/ontologies/product-market-codes/T24068Microwaves.Optical engineering.Nanotechnology.Electronic circuits.Microwaves, RF and Optical Engineering.Nanotechnology and Microengineering.Circuits and Systems.620620.5621.3621.3815Fischer-Hirchert Ulrich H. Pauthttp://id.loc.gov/vocabulary/relators/aut720624BOOK9910299841503321Photonic Packaging Sourcebook1412144UNINA