01357nam0-2200421---450 99000069099020331620190506095047.088-15-00505-60028928USA010028928(ALEPH)000069099USA0120011016d1984----km y1itay5003 baitaengITEconomia industrialeteoria e verifiche empiricheDonald A. Hay, Derek J. MorrisBolognaIl mulino1984704 p.22 cmStrumentiEconomiaTraduzione di Ada Carlesi, Giovanni Forte, Arrigo Lupo BerghiniEdizione italiana a cura di Paolo Mariti2001StrumentiEconomia2001Industrial economicstheory and evidence12988economia industrialeBNCF338HAY,Donald A.112700MORRIS,Derek J.112701IT990000690990203316338 HAY 1 (Testi 1443)4749 ECTesti00234417Testi 1443 (non disponbile)4750 ECTesti338 HAY 1a (Testi 1443)4751 ECTesti00009127300 338 HAY2941 DISES300 338 HAY3469 DISESBKECODISESIndustrial economics12988UNISA04064nam 2201033z- 450 991055736190332120220111(CKB)5400000000042273(oapen)https://directory.doabooks.org/handle/20.500.12854/76483(oapen)doab76483(EXLCZ)99540000000004227320202201d2021 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierHybrid Bulk Metal ComponentsBasel, SwitzerlandMDPI - Multidisciplinary Digital Publishing Institute20211 online resource (224 p.)3-0365-0884-8 3-0365-0885-6 In recent years, the requirements for technical components have steadily been increasing. This development is intensified by the desire for products with a lower weight, smaller size, and extended functionality, but also with a higher resistance against specific stresses. Mono-material components, which are produced by established processes, feature limited properties according to their respective material characteristics. Thus, a significant increase in production quality and efficiency can only be reached by combining different materials in a hybrid metal component. In this way, components with tailored properties can be manufactured that meet the locally varying requirements. Through the local use of different materials within a component, for example, the weight or the use of expensive alloying elements can be reduced. The aim of this Special Issue is to cover the recent progress and new developments regarding all aspects of hybrid bulk metal components. This includes fundamental questions regarding the joining, forming, finishing, simulation, and testing of hybrid metal parts.Technology: general issuesbicsscair-water spray coolingAISI 52100aluminum-steel compoundbearing fatigue lifebenchmarkbevel gearsbulk metal formingco-extrusioncoatingcompositescomputer-aided engineering environmentcross-wedge rollingdamageexcitation methodsfeeling machineformingfriction weldinggeometry measurementGPDAhot forgingHSHPThybrid bearinghybrid componentshybrid metal componentsintermetallic phasesIZEOjoining zonelaser beam weldinglateral angular co-extrusionLMD-Wmanufacturing restrictionsmechanical behaviormelt pool dynamicsmembrane mode enhanced cohesive zone elementsmulti-materialnano multilayersnanoindentationNi-Tinickel base alloy 2.4856plasma transferred arc weldingprocess monitoringprocess-integrated heat treatmentPTAresidual stressresidual stressesrollingrolling contact fatiguescanning acoustic microscopyself-temperingSPDsurface geometry modificationtailored formingtopology optimizationturningultrasoundweldingwrought-hot objectsX-ray diffractionTechnology: general issuesBehrens Bernd-Arnoedt1311339Behrens Bernd-ArnoothBOOK9910557361903321Hybrid Bulk Metal Components3030263UNINA04026nam 2201033z- 450 991055728740332120210501(CKB)5400000000041166(oapen)https://directory.doabooks.org/handle/20.500.12854/68980(oapen)doab68980(EXLCZ)99540000000004116620202105d2020 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierSilicon Photonics BloomBasel, SwitzerlandMDPI - Multidisciplinary Digital Publishing Institute20201 online resource (184 p.)3-03936-908-3 3-03936-909-1 The open access journal Micromachines invites manuscript submissions for the Special Issue "Silicon Photonics Bloom". The past two decades have witnessed a tremendous growth of silicon photonics. Lab-scale research on simple passive component designs is now being expanded by on-chip hybrid systems architectures. With the recent injection of government and private funding, we are living the 1980s of the electronic industry, when the first merchant foundries were established. Soon, we will see more and more merchant foundries proposing well-established electronic design tools, product development kits, and mature component libraries. The open access journal Micromachines invites the submission of manuscripts in the developing area of silicon photonics. The goal of this Special Issue is to highlight the recent developments in this cutting-edge technology.]History of engineering and technologybicsscamorphous silicon oxycarbideBragg gratingscarrier plasmachemical vapor depositiondefectdispersion controlelectrostatic actuatorfrequency combsgermaniumheterogeneous integrationintegrated opticsintegrated photonicsintegrated polarimeterintegrated silicon photonic circuitslight emitting diodeMach-Zehnder interferometersmicro-platformmicroelectromechanical systems (MEMS)mode-locked lasersmodulatormultimode interferometern/ananophononicsnitrogen dopingnonlinear opticsoff-chip couplingoptical interconnectsoptical switchoptical waveguideoptoelectronicsparallel plate actuationphase change materialphotoconductivityphotoluminescencephotonic processorsphotonics integrated circuitphysical vapor depositionplasma enhanced chemical vapor depositionpolarisation controllerpolarisation multiplexingpolarisation shift keyingquantum dotsecond-harmonic generationsilicon nanocrystalssilicon nitride photonicssilicon optical modulatorsilicon oxynitridesilicon photonicsSilicon Photonicssilicon-on-insulator (SOI)supercontinuumterahertzthin filmunitary transformationvertical grating couplerWDM transmitterHistory of engineering and technologyBoyraz Ozdaledt1302201Zhao QianchengedtBoyraz OzdalothZhao QianchengothBOOK9910557287403321Silicon Photonics Bloom3026242UNINA