02116nam 2200457z- 450 9911115501603321202102111000086125(CKB)4920000000101024(oapen)https://directory.doabooks.org/handle/20.500.12854/50197(oapen)doab50197(EXLCZ)99492000000010102420202102d2019 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierInfluence of strain on the functionality of ink-jet printed thin films and devices on flexible substratesKIT Scientific Publishing20191 online resource (X, 127 p. p.)Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie3-7315-0853-2 Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.Technology: general issuesbicsscDünnschichtbauteilelectro-mechanical characterizationelektromechanische Charakterisierungflexible electronicsflexible ElektronikInk-jet druckenInk-jet printingsynchrotron X-ray diffractionSynchrotron-Röntgenbeugungthin-film devicesTechnology: general issuesMishra Nileshaauth2007562BOOK9911115501603321Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates4794436UNINA