02923nam 2200697Ia 450 991102033530332120200520144314.09786613650047978128067311512806731179781118166741111816674497811181667271118166728978111816675811181667529786613650047(CKB)2670000000166902(EBL)818509(SSID)ssj0000622811(PQKBManifestationID)11435049(PQKBTitleCode)TC0000622811(PQKBWorkID)10643553(PQKB)10528881(MiAaPQ)EBC818509(CaBNVSL)mat06183551(IDAMS)0b000064817eb439(IEEE)6183551(OCoLC)793103961(PPN)270633723(Perlego)1002040(EXLCZ)99267000000016690220110708d2012 uy 0engur|n|---|||||txtccrElectrical modeling and design for 3D integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC /Er-Ping LiHoboken, N.J. Wileyc20121 online resource (390 p.)Description based upon print version of record.9780470623466 0470623462 Includes bibliographical references and index.Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and Three-dimensional integrated circuitsIntegrated circuitsThree-dimensional integrated circuits.Integrated circuits.621.3815TEC008050bisacshLi Er-Ping1636077MiAaPQMiAaPQMiAaPQBOOK9911020335303321Electrical modeling and design for 3D integration4417664UNINA