01238nam2 22002891i 450 UON0052573520240828113316.25820240828d1949 |0itac50 baengUS|||| |||||2: J-ZNew YorkFunk and Wagnalls1949534-1196 p.30 cm.001UON005225562001 Funk and Wagnalls standard dictionary of folklore, mythology and legendeditor Maria Leachassociated editor Jerome Fried210 New YorkFunk and Wagnalls Company215 2 volumi.25 cm2FolcloreDizionariUONC102650FIUSNew YorkUONL000050398.03Folclore. Dizionari21LeachMariaUONV2944501589289FriedJeromeUONV2944511589290Funk and Wagnalls Co.UONV256573650ITSOL20251205RICASIBA - SISTEMA BIBLIOTECARIO DI ATENEO E ARCHIVIO STORICOUONSIUON00525735SIBA - SISTEMA BIBLIOTECARIO DI ATENEO E ARCHIVIO STORICOSI S.C ENC 0042 SI ST 1448 7 0042 2: J-Z4409518UNIOR01909nam 2200493Ia 450 991100666800332120200520144314.01-282-00261-997866120026180-8155-1745-9(CKB)111056552535284(OCoLC)300753709(CaPaEBR)ebrary10265812(MiAaPQ)EBC3008716(BIP)46738214(EXLCZ)9911105655253528419871119d1988 uy 0engurcn|||||||||txtrdacontentcrdamediacrrdacarrierHandbook of contamination control in microelectronics principles, applications, and technology /edited by Donald L. TolliverPark Ridge, N.J., U.S.A. Noyes Publicationsc19881 online resource (510 p.) Materials science and process technology series9780815511515 0-8155-1151-5 Includes bibliographies and index.This second edition, edited by the world-renowned Dr. Rointain Bunshah, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. Considerably more material was added in Plasma Assisted Vapor Deposition processes, as well as Metallurgical Coating Applications.Materials science and process technology series.Integrated circuitsDesign and constructionContamination (Technology)Integrated circuitsDesign and construction.Contamination (Technology)621.381/73Tolliver Donald L1824777MiAaPQMiAaPQMiAaPQBOOK9911006668003321Handbook of contamination control in microelectronics4392091UNINA